Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
W25Q64JVXGIQ 是由华邦电子(WINBOND)推出的一款高性能串行闪存芯片。该产品采用 XSON-8-EP 封装,具有低功耗、高速度、和较大的存储容量,广泛应用于消费电子、工业控制、通信设备、智能家居及物联网(IoT)设备等多个领域。
W25Q64JVXGIQ 的核心参数是其内部存储容量,达到 64Mb(8MB),足以应对大多数微控制器和数字信号处理器(DSP)的外部存储需求。该串行闪存支持多种存储模式,包括 Quad I/O 和 Dual I/O 模式,能够有效提升数据传输速度,实现快速数据读取与写入。其最高读取速度可达 104MHz,为高速应用提供了强有力的支持。
W25Q64JVXGIQ 的工作电压范围为 2.7V 至 3.6V,具备良好的电源兼容性,适用于多种低功耗环境。这款闪存具有极低的待机功耗和主动功耗,使其在移动和电池供电设备中表现出色。特别是在 IoT 设备和传感器节点中,低功耗特性对于延长电池寿命至关重要。
W25Q64JVXGIQ 的 XSON-8-EP 封装设计使得其在 PCB 上占用的空间非常小,极适合高密度布线的电子设备。在现代消费电子产品和小型设备中,空间的节省和封装的紧凑性是设计考虑的重要因素。该封装不仅减少了电路板上的占用面积,同时也增强了产品的整体可靠性。
W25Q64JVXGIQ 可广泛应用于各种领域,包括但不限于:
W25Q64JVXGIQ 具有丰富的附加功能,如多种工作模式,支持快读模式、页面编程等。还支持深度掉电模式,降低功耗,延长设备的使用寿命。此外,该芯片能够提供误差校正功能,以确保数据的安全性和完整性,为应用提供了额外的保障。
W25Q64JVXGIQ 是一款结合高性能、高容量和低功耗的优质串行闪存产品。其出色的特性使其非常适合于当今电子设备需求日益增长的存储解决方案。无论是在嵌入式应用、消费电子还是物联网领域,W25Q64JVXGIQ 都能提供稳定、可靠的支持,是设计师和工程师在选用存储芯片时的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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