WMSIC Electronic Components

worldsemi WS2850B-2020 WS2850B

ModelWS2850B-2020
PackageSMD2020-6P
BrandWORLDSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
worldsemi WS2850B-2020
Type
WORLDSEMI
Minimum package
4500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WORLDSEMI
Electronic Component
WS2850B-2020
Electronic Component
1
Electronic Component
2mm
Package
SMD2020-6P
Electronic Component
G:515nm~525nm;B:465nm~475nm;R:620nm~630nm
Electronic Component
RGB LED
Electronic Component
0.049g
Electronic Component
2.2mm
Electronic Component
0.84mm
Electronic Component
1
LED
G:1200mcd;R:400mcd;B:300mcd
LED
120°
Electronic Component
BM0264717387
Current
R:20mA;B:20mA;G:20mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WS2850B-2020 产品概述

一、产品简介

WS2850B-2020 是一款面向消费电子与显示应用的高性能 SMD RGB 三色发光组件。采用 worldsemi 原装 RGB 芯片并结合 Moding 高质量封装工艺,封装小巧、气密性好、透明度高且耐高温,适合 LED 风扇、数码电子、点光源、像素屏及各类异形屏和跑马灯等场景。

二、主要参数

  • 封装型号:SMD2020-6P(独立三色二极管配置)
  • 波长:R 620nm630nm;G 515nm525nm;B 465nm~475nm
  • 发光强度(典型):G 1200 mcd;R 400 mcd;B 300 mcd(测量条件通常为 IF=20mA)
  • 发光角度:120°
  • 正向电流(建议):R/B/G 20 mA(单色)
  • 正向压降 Vf:R 1.8V2.4V;G 2.8V3.4V;B 2.8V~3.4V
  • 外形尺寸:长 2.2 mm × 宽 2.0 mm × 高 0.84 mm
  • 品牌:worldsemi

三、特性与优势

  • 小体积、高亮度:SMD2020 级别的紧凑封装,适合高密度布局,G 色亮度尤其突出,利于色彩还原与视觉冲击。
  • 独立二极管设计:三色为独立引脚,便于精确驱动与颜色校准,可实现更灵活的 PWM 调光与色彩混合控制。
  • 优良封装工艺:采用 Moding 气密封装,透光性好且耐高温,封装一致性高,长期使用下色差小、寿命稳定。
  • 散热性能优:尽管体积小,但封装和材料有利于热量传导,配合合理 PCB 散热设计可保持稳定发光与寿命。
  • 产品一致性:使用原装芯片,波长和亮度一致性好,适合像素级阵列及精确颜色控制的场合。

四、典型应用

  • LED 风扇与装饰灯
  • 数码电子产品指示与背光
  • LED 点光源与像素屏(小间距点阵)
  • LED 异形屏、跑马灯与广告装置
  • 各类需要高一致性 RGB 显示的电子设备

五、封装与机械注意事项

  • 推荐在 PCB 上预留与 SMD2020-6P 匹配的焊盘和阻焊孔,以确保贴装强度与热传导。
  • 焊接建议遵循常规无铅回流曲线(请参考包装中具体回流温度曲线),避免超出封装耐温极限。
  • 安装时注意三色引脚的极性与电气隔离,防止在焊接或回流过程中出现短路。

六、驱动与可靠性建议

  • 推荐使用限流电阻或恒流驱动,单色最大建议工作电流不超过 20 mA;长时间驱动建议适当降额(例如 10%~30%)以延长寿命。
  • PWM 调光建议采用较高频率以避免肉眼可见闪烁,同时保证占空比与色彩线性校准。
  • 设计时注意散热路径与环境温度,过高结温会影响亮度与寿命,应在规格内进行热设计与验证。
  • 注意 ESD 防护与储运防潮,未使用前存放于防潮包装中。

WS2850B-2020 以其小型化、高一致性与良好封装特性,适合对尺寸、色彩一致性和可靠性有较高要求的多种 LED 应用场景。若需电气原理图建议、PCB Footprint 或回流曲线等详细设计资料,可提供进一步支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.