WMSIC Electronic Components

worldsemi WS2812E-1313 WS2812E

ModelWS2812E-1313
PackageSMD1313
BrandWORLDSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
worldsemi WS2812E-1313
Type
WORLDSEMI
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WORLDSEMI
Electronic Component
WS2812E-1313
Electronic Component
1
Electronic Component
1.3mm
Package
SMD1313
Electronic Component
R:620nm~625nm;B:449nm~454nm;G:520nm~525nm
Electronic Component
RGB LED(Built-in IC)
Electronic Component
0.071g
Electronic Component
1.3mm
Electronic Component
0.65mm
Electronic Component
1
Features
Built-in positions; Integrated; Built-in positions
LED
R:260mcd;B:88mcd;G:800mcd
Electronic Component
BM0264538724
Operating Temperature
40℃~+65℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WS2812E-1313 产品概述

一、产品简介

WS2812E-1313 是 worldsemi 推出的超小型可寻址 RGB SMD 发光单元,采用 SMD1313 封装,外形尺寸仅 1.3 × 1.3 × 0.65 mm。器件集成驱动电路与保护功能,面向对体积、成本和安装密度有较高要求的照明与显示类产品,提供高性价比的像素级点光源解决方案。

二、核心参数

  • 波长:R 620–625 nm;G 520–525 nm;B 449–454 nm
  • 发光强度(典型):R 260 mcd;G 800 mcd;B 88 mcd
  • 数据速率:800 Kbit/s(单线串行控制,兼容 WS2812 协议)
  • 工作电压:3.7 V ~ 5.3 V
  • 静态电流(待机):0.6 mA
  • 抗静电能力:4 000 V(HBM)
  • 工作温度:-40 ℃ ~ +65 ℃
  • 尺寸:1.3 mm × 1.3 mm × 0.65 mm
  • 功能特性:内置上电复位、掉电复位与反向连接保护
  • 封装:SMD1313,品牌:worldsemi

三、主要特性

  • 极小体积,便于高密度排布与微型化设计
  • 内置智能上电/掉电复位,降低上电异常带来的数据错位风险
  • 集成反向连接保护,提高产品可靠性与装配容错性
  • 单线高速数据传输(800 Kbit/s),支持像素级寻址与复杂灯效控制
  • 低静态电流,适合低功耗场景

四、典型应用

  • 可穿戴设备、智能手表与微型指示灯
  • 小型点阵与像素化装饰灯条、灯带
  • 小尺寸商显、仪表盘与玩具类光效模块
  • IoT 外设与消费电子中的状态指示与场景照明

五、设计与使用建议

  • 电源:确保工作电压维持在 3.7–5.3 V,长连串建议在适当位置补偿电压降;靠近每颗器件放置去耦电容(如 0.1 µF)以保证供电稳定。
  • 信号兼容:控制信号需符合 WS2812 单线时序规范;若 MCU 电平低于 VDD(例如 3.3 V 驱动 5 V 器件),建议使用高速电平转换器以保证可靠通信。
  • 焊接与可靠性:兼容常规回流焊工艺,建议在 PCB 设计时为 SMD1313 预留合适焊盘并注意热扩散,避免过度机械应力。
  • 防静电与存储:生产与装配环境建议采取 ≥ 4 kV HBM 级别的静电防护措施,存放应避免潮湿并遵循封装说明。
  • 温度管理:工作环境请控制在额定温区内,散热不佳时尽量降低单点亮度或增加间隔以延长寿命。

六、包装与订购信息

  • 品牌:worldsemi
  • 型号示例:WS2812E-1313(SMD1313 封装)
  • 适合智能灯条、微型像素模块等高密度贴装需求,支持批量 SMT 自动化生产。

总结:WS2812E-1313 以其微小尺寸、内置复位与保护电路、以及兼容 800 Kbit/s 的 WS2812 控制特性,适合体积受限且追求像素级控制的各类照明与显示产品,是一款高性价比的 SMD RGB 器件。若需参考电气时序或回流焊曲线,请联系 worldsemi 获取完整技术资料与应用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.