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worldsemi WS2850B-GRB1 WS2850B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- worldsemi WS2850B-GRB1
- Type
- WORLDSEMI
- Minimum package
- 1000 圆盘
Technical parameters
- Power
- B:100mW；R:75mW；G:100mW
- Electronic Component
- Electronic Component
- Electronic Component
- WORLDSEMI
- Electronic Component
- WS2850B-GRB1
- Electronic Component
- 1
- Electronic Component
- 5mm
- Package
- SMD5050-6P
- Electronic Component
- R:621nm；G:518nm；B:471nm
- Electronic Component
- RGB LED
- Electronic Component
- 0.151g
- Electronic Component
- 5mm
- Electronic Component
- 1
- LED
- G:1400mcd~1500mcd；R:700mcd~750mcd；B:320mcd~350mcd
- LED
- 120°
- Electronic Component
- BM0264717370
- Current
- R:20mA；B:20mA；G:20mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WS2850B-GRB1 产品概述
一、产品简介
WS2850B-GRB1 是 worldsemi 出品的普通七彩 RGB 5050 SMD 发光单元，内含配套驱动 IC，三色为独立二极管结构（GRB 排列），适用于各类灯条、灯带、博彩机与游乐设备等需要逐点可控色彩的场合。无色透明透镜，发光均匀，视角宽广，适合成列安装与常规表贴回流工艺。
二、主要规格参数
- 封装：SMD5050-6P（5.0 × 5.0 mm）
- 二极管配置：独立二极管（GRB）
- 波长：R = 621 nm；G = 518 nm；B = 471 nm
- 发光强度（典型／范围）：G = 1400–1500 mcd；R = 700–750 mcd；B = 320–350 mcd
- 发光角度：120°
- 透镜颜色：无色透明
- 正向电流：R/B/G = 20 mA（单色）
- 正向压降（Vf）：R = 2.0 V；G = 3.2 V；B = 3.2 V
- 功率额定（单色）：R = 75 mW；G = 100 mW；B = 100 mW
- 封装方式：表面贴装（正贴）
- 载带/卷盘适配：SMD 贴片生产线兼容
三、产品特点
- 三色独立、逐点可控：内置配套驱动 IC，可实现单像素色彩混合与 PWM 调光。
- 高亮度与宽视角：120° 发光角度与高光强，适合远视与近视同等显示需求。
- 通用封装：标准 5050 大小，易于与常见灯条基板、PCB 兼容，安装与替换方便。
- 透镜透明：颜色还原性好，色彩一致性高，利于色彩校正和均匀照明效果。
四、典型应用
- LED 灯条/灯带（装饰、氛围照明）
- 博彩机、电子游戏机、游乐设备的点光源与效果灯
- 背光与指示灯、舞台辅助照明等需要可编程色彩的场景
五、封装与机械信息
- 尺寸：5 mm × 5 mm（5050 标准）
- 引脚与焊盘：符合 SMD 5050 常规焊盘布局，支持回流焊工艺。建议在设计 PCB 时留足热扩散与焊盘面积以保证可靠焊接与良好散热。
六、驱动与使用建议
- 推荐单色正向电流 20 mA，使用 PWM 调光可获得良好色彩混合与亮度控制。
- 使用配套驱动 IC 或恒流源以保证颜色一致性与长期稳定；避免直接用恒压驱动且无限流措施。
- 注意整体温升与散热：多颗并列时应考虑基板散热与间距，避免长时间满流工作导致光衰与寿命下降。
- 在设计灯带或成列点阵时，合理安排驱动与电源布线，防止远端压降造成色偏。
七、注意事项与存储
- 回流焊建议遵循通用无铅焊接曲线，避免超时高温暴露造成透镜或内封装损伤。
- 储存避免潮湿环境，推荐干燥防潮包装，开盘后尽快使用或按标准回潮处理。
- 安装与维修时注意静电防护与正确极性，避免反向电压或过流损坏元件。
如需具体电气特性曲线、驱动协议或 PCB 焊盘尺寸图纸，可提供进一步技术资料以便设计和量产对接。
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