WMSIC Electronic Components

worldsemi WS3570

ModelWS3570
PackageSMD,7x3.5mm
BrandWORLDSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
worldsemi WS3570
Type
WORLDSEMI
Minimum package
1000 圆盘

Technical parameters

Power
30W
Electronic Component
Electronic Component
Electronic Component
WORLDSEMI
Electronic Component
WS3570
Electronic Component
1
Package
SMD,7x3.5mm
Electronic Component
LEDDiode / LED
Electronic Component
6200K~6700K
Electronic Component
0.122g
Electronic Component
1
LED
120°
LED
Electronic Component
Electronic Component
BM0264717369
Operating Temperature
30℃~+125℃
Current
1.2A
Diode
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WS3570 产品概述

一、产品简介

WS3570 是 worldsemi 面向汽车照明的高功率 SMD 灯珠,采用倒装芯片工艺(flip‑chip),单颗功率 30W,发光颜色为冷白(色温 6200K~6700K)。封装尺寸为 7×3.5 mm,二极管配置为共阳极,提供雾状黄色与雾状白色两种透镜选择,光束角约 120°,适用于多种车用照明场景。

二、主要特性

  • 功率:30W(单颗)
  • 正向电流:1.2A(额定)
  • 正向压降(Vf):8.5V ~ 10V(在额定电流下)
  • 色温:6200K~6700K(冷白)
  • 发光角度:120°
  • 工作温度:-30℃ ~ +125℃
  • 封装:SMD,7×3.5 mm;倒装芯片,良好热路径
  • 二极管配置:共阳极;透镜:雾状黄色 / 雾状白色

三、典型应用

  • 汽车外部照明:日间行车灯、近光/远光补助光源(视系统设计)
  • 汽车内部及装饰照明
  • 信号灯、转向灯、位置灯与标识灯(marker)
  • 其他需要高显色性与稳定冷白光的车载照明场景

四、电气与光学建议

  • 使用恒流驱动器驱动,额定电流 1.2A;驱动器须能覆盖 8.5V~10V 输出范围并具备过流保护。
  • 为保证光通与寿命,设计中应考虑热降额,随结温升高适当降低电流。
  • 建议在电源与灯珠间加入反向保护与浪涌抑制电路以应对汽车电气扰动。

五、热管理与可靠性

  • 倒装芯片结构利于热量直接传导至焊盘,要求 PCB 采用散热铜泊或金属基板并做好热过孔布局。
  • 在高温条件(接近 +125℃)下应评估光衰与色温漂移,必要时增加散热片或强制风冷。

六、封装与组装建议

  • 封装为 SMD,推荐采用常规回流焊工艺进行贴装,遵循制造商的回流曲线与焊膏规范。
  • 装配时注意 ESD 防护与静电敏感元件处理,避免反接与瞬态电压损伤。

七、测试与质量保证

  • 在量产前进行热循环、振动、盐雾与高低温老化测试,确保满足车规环境下的长期可靠性。
  • 建议针对整车应用做 EMC 与电磁抗扰度验证。

八、采购与技术支持

WS3570 由 worldsemi 提供,适合需要高亮、宽光束且具备严格热管理设计的车用照明方案。具体样品、典型应用电路与回流参数可向厂商技术支持获取。

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