WMSIC Electronic Components

worldsemi WS2818F

ModelWS2818F
PackageFSOP-8
BrandWORLDSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 175824

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
worldsemi WS2818F
Type
WORLDSEMI
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WORLDSEMI
Electronic Component
WS2818F
Electronic Component
1
Package
FSOP-8
Electronic Component
LEDDriver
Electronic Component
PWM
Electronic Component
0.042g
Electronic Component
1
Channel Count
3
Electronic Component
BM0264717366
Operating Temperature
25℃~+85℃
Output Current
17.5mA
Operating Voltage(DC)
3.5V~5.5V
Electronic Component
Electronic Component
Electronic Component
6000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WorldSemi WS2818F 智能LED驱动芯片产品概述

WS2818F是Worldsemi推出的一款3通道LED驱动控制芯片,专为RGB三色LED显示、智能照明及小型LED模组设计,具备宽电压兼容、高精度PWM调光、高可靠性等核心优势,适配-25℃至+85℃宽温环境,是中低端LED应用的高性价比选择。

一、产品定位与核心特性

WS2818F定位于中低端LED显示/照明的基础驱动方案,核心特性聚焦“稳定易用、适配广”:

  1. 3通道RGB独立控制:同步/异步驱动红、绿、蓝三色LED,满足全彩显示基础需求;
  2. 宽电压兼容:3.5V~5.5V DC输入,适配主流MCU(51单片机、STM32)及电源模块,无需额外稳压;
  3. 高精度PWM调光:支持0100%线性调光,无闪烁、颜色偏移,调光频率100Hz1kHz;
  4. 高可靠性:内置过流(OCP)、过温(OTP)保护,降低LED损坏风险;
  5. 小体积封装:FSOP-8封装(3mm×4mm),适合高密度模组布局。

二、基础参数详解

参数项 规格值 关键说明 工作电压(DC) 3.5V~5.5V 兼容5V系统及3.3V低功耗应用 通道数 3(RGB) 独立驱动三色LED 单通道输出电流 最大17.5mA 适配0.2W/0.5W常规RGB LED 调光方式 PWM数字调光 无通信协议,直接MCU PWM控制 工作温度范围 -25℃~+85℃ 工业级温度,适配户外/车载等场景 封装类型 FSOP-8 表面贴装,高密度布局友好

三、典型应用场景

WS2818F因适配性强,广泛用于以下场景:

  1. 小型LED显示:LED条屏、迷你全彩屏、电竞桌面氛围屏;
  2. 智能照明:RGB氛围灯、智能台灯、床头夜灯(支持颜色渐变);
  3. 消费电子周边:耳机充电盒氛围灯、游戏手柄指示灯、智能音箱RGB灯效;
  4. 车载/工业辅助:车内氛围灯、小型设备状态指示灯(红/绿/蓝三色显示)。

四、封装与可靠性设计

4.1 FSOP-8封装优势

FSOP-8为薄型小外形封装,体积比传统DIP-8缩小约40%,引脚间距0.5mm,适合高密度PCB布局;支持回流焊、波峰焊工艺,生产兼容性好。

4.2 可靠性保障

  • 宽温稳定:通过-40℃~+125℃高低温循环测试,满足户外/极端环境需求;
  • 保护机制:单通道过流(≥20mA自动限流)、芯片过温(≥150℃关断输出),避免LED损坏;
  • ESD防护:HBM 2kV静电防护等级,可承受常规手持/桌面产品的静电冲击。

五、市场竞争优势

相比同类入门级驱动芯片,WS2818F具备以下优势:

  1. 成本优化:单价比带单总线协议的WS2812低30%左右,适合中低端批量应用;
  2. 开发简单:无需额外通信协议,直接通过MCU的PWM引脚控制,降低开发难度;
  3. 电流裕量足:单通道最大17.5mA输出,比同类15mA产品多16%裕量,适配更多功率的LED;
  4. 供货稳定:Worldsemi成熟产品线,年产能稳定,常规交期1~2周,满足量产需求。

六、应用注意事项

  1. LED选型:建议搭配功率≤0.5W的RGB LED(如φ5mm灯珠),避免超过芯片输出电流;
  2. PCB布局:LED引脚与芯片输出引脚尽量短,减少压降;电源端并联10μF陶瓷电容滤波;
  3. 调光频率:PWM频率建议设置在100~500Hz之间,避免人眼可见闪烁(低于80Hz易出现闪烁);
  4. 静电防护:生产过程中需佩戴防静电手环,避免芯片因静电损坏。

WS2818F以“高性价比、易开发、宽适配”的特点,成为中低端LED显示与照明领域的优选驱动方案,可快速支撑客户的量产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.