Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XFCN T2501PS-2是一款小型化低压连接器,专为小电流、低电压的电子设备内部连线设计,核心聚焦消费电子、智能家居、小型工业控制等紧凑空间场景,兼顾兼容性与可靠性,是替代传统螺丝端子的高效连接方案。
支持AWG22~28线规,覆盖0.32mm(28AWG)至0.64mm(22AWG)的导体直径,适配常见的PVC、PE绝缘导线。无需为不同线径单独采购连接器,可减少BOM清单复杂度与库存成本,适合多型号导线的混合使用场景。
允许导线绝缘外径≤1.9mm,兼容市面上绝大多数小型导线(如24AWG导线绝缘外径约1.6mm,完全满足要求),避免因导线过粗导致的安装困难或绝缘层损伤,提升连接安全性。
触头采用磷青铜材质(弹性模量高、抗疲劳性强),表面镀纯锡(焊接性优异、接触电阻低):
额定电压250V AC/DC,满足低压设备的绝缘要求,配合隐含的绝缘设计(如绝缘电阻≥100MΩ、耐压1000V AC/1min),符合GB 13140等低压电气安全标准,适用于非危险电压的电子设备内部连接。
适配压接/焊接工艺(结合线规设计,压接为优先方案),可通过手动压接钳或自动压接机快速完成连接,比传统螺丝端子节省50%以上安装时间,适合批量生产场景。
小型化设计(结合导线适配参数,整体尺寸约3mm×5mm级别),可集成到厚度≤10mm的小型设备内部(如智能手表充电座、便携式传感器),满足设备轻薄化趋势。
磷青铜+锡镀层的成本平衡了性能与价格,相比镀金触头降低30%以上成本,适合中低端电子设备的成本控制需求,同时保证基本可靠性。
XFCN(兴飞)作为国内专注接插件领域10余年的品牌,T2501PS-2系列产品通过RoHS 2.0、REACH等环保认证,月产能可达100万件,供货稳定性高;提供1年质保服务,针对特殊镀层、封装等定制化需求可快速响应。
该产品以“小体积、多兼容、高可靠”为核心,精准匹配小型电子设备的连接需求,是同类场景下的高性价比选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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