WMSIC Electronic Components

XFCN T3025PS-2 T3025PS

ModelT3025PS-2
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 175863

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
XFCN T3025PS-2
Type
XFCN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
T3025PS-2
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.06g
Electronic Component
50
Electronic Component
BM0265820800
AWG
20~24
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XFCN T3025PS-2 连接器产品概述

XFCN(兴飞)T3025PS-2是一款针对低功率电子设备内部连接设计的小型插拔式连接器,主打高性价比与稳定可靠性,广泛适配智能家居、小型工业传感、消费电子模块等场景的批量应用需求。

一、产品定位与典型应用场景

T3025PS-2定位于经济型通用连接器,核心解决小电流、低电压场景下的电路连接问题,避免高端连接器的冗余性能,兼顾成本与实用性。其典型应用包括:

  • 智能家居领域:智能开关、温湿度传感器、小型控制器的内部 wiring 连接;
  • 消费电子领域:智能穿戴设备(如手环、手表)的电池与主板连接、小型蓝牙模块接线;
  • 小型工业领域:低功率传感器(如接近开关、光电传感器)与PLC的辅助接线;
  • 车载辅助领域:车载充电器、氛围灯控制器的内部连接。

二、核心电气性能参数

T3025PS-2的电气性能严格匹配目标应用场景,关键参数如下:

参数项 规格值 说明 额定电压 250V AC/DC 满足低压设备的安全电压要求 额定电流范围 1A(24AWG)~3A(20AWG) 适配线规对应的最大载流能力 触头材质 磷青铜(C5191) 兼具良好弹性与导电性,保证接触可靠性 触头镀层 纯锡(Sn) 提升耐腐蚀性,降低接触电阻 接触电阻 ≤20mΩ(初始) 确保信号/电流传输无明显损耗 绝缘电阻 ≥1000MΩ(500V DC) 防止漏电,保障电气安全

三、机械结构与材质特性

T3025PS-2采用模块化插拔设计,机械性能适配批量安装需求:

  1. 压线适配性:支持20~24AWG线规,覆盖常见小线径应用,压线方式为压接(需专用压接工具),避免焊接带来的虚焊风险;
  2. 触头结构:磷青铜端子采用弹性设计,插拔时能紧密贴合针座触头,减少松动;
  3. 插拔力:插入力≥10N,拔出力≥3N,避免意外脱落同时保证手动插拔顺畅;
  4. 端子数量:支持2~5P模块化配置(可根据需求定制),适配不同电路的多线连接。

四、安装与使用注意事项

为保证T3025PS-2的长期可靠性,安装使用需注意以下要点:

  1. 线规匹配:严禁使用20AWG以下(过粗)或24AWG以上(过细)线径,否则易导致压线不牢、接触不良;
  2. 压接工具:必须使用适配T3025PS-2端子的专用压接钳,压接深度需符合厂家标准(一般0.8~1.0mm),避免压接过深损坏端子或过浅导致脱落;
  3. 插拔规范:插拔时需垂直于连接器方向施力,禁止倾斜插拔,防止触头变形;
  4. 环境防护:避免在潮湿、多尘或腐蚀性气体环境下长期使用(如需特殊环境,需额外做防护处理)。

五、可靠性与环境适应性

T3025PS-2的可靠性设计满足常规应用场景需求:

  • 工作温度范围:-20℃~85℃,适配室内及一般车载环境;
  • 插拔寿命:≥500次,满足产品生命周期内的维修、更换需求;
  • 振动冲击:10~2000Hz振动下(加速度10g),触头无松动,电气性能稳定;
  • 耐腐蚀性:锡镀层在常温下耐氧化,盐雾试验(5%NaCl,48h)后接触电阻无明显变化。

总结:XFCN T3025PS-2作为一款经济型通用连接器,凭借稳定的电气性能、适配性强的机械结构,成为低功率电子设备内部连接的可靠选择,尤其适合对成本敏感的批量应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.