WMSIC Electronic Components

XFCN F0502-B-08-15T-R F0502

ModelF0502-B-08-15T-R
PackageSMD, P=0.5mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 175934

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN F0502-B-08-15T-R
Type
XFCN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
F0502-B-08-15T-R
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.194g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265746602
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
1.5mm
Electronic Component
8P
Type
Electronic Component
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F0502-B-08-15T-R FFC/FPC连接器产品概述

一、产品核心定位

F0502-B-08-15T-R是XFCN(兴飞)针对高密度轻薄化电子设备推出的柔性电路连接组件,聚焦FFC(柔性扁平电缆)与FPC(柔性印刷电路)的可靠互联,兼具「小尺寸、易装配、高稳定性」三大核心优势,适配消费电子、便携式设备等多场景的紧凑空间连接需求。

二、关键参数与设计亮点

1. 高密度小型化规格

  • 核心参数:8P(8pin)触点、0.5mm间距、1.5mm板上高度、卧贴SMD封装,兼容0.3mm厚度FFC/FPC电缆;
  • 设计优势:0.5mm间距实现高密度布线,1.5mm板高可适配智能手表、蓝牙耳机等终端的「毫米级内部空间」,无需额外牺牲设备体积。

2. 翻盖式便捷锁定

  • 结构特点:采用「翻盖式」锁定(区别于传统抽拉/按压式),装配时仅需3步:翻开翻盖→插入电缆→闭合锁定,全程无需工具;
  • 可靠性:锁定后可承受10N以上拉扯力,防止电缆因振动、日常使用脱落,耐插拔次数≥500次(符合行业标准)。

3. 下接式触点布局

  • 布局逻辑:触点从连接器下方与电缆接触,主体贴装于PCB表面,不占用PCB上方空间;
  • 适配场景:适合设备内部「多层电路堆叠」或「狭小垂直空间」(如智能手机副板与主板的隐藏式连接)。

三、安装与生产适配性

1. 自动化贴装兼容

  • 封装适配:卧贴SMD封装完全匹配回流焊工艺,可实现批量自动化生产,减少人工装配误差;
  • 材料耐受:主体采用LCP(液晶聚合物)耐高温塑料,可承受260℃回流焊高温,无变形、开裂风险。

2. 简化装配流程

  1. PCB表面贴装连接器→回流焊固化;
  2. 翻开翻盖至90°,将0.3mm FFC/FPC电缆插入触点槽(需对齐防呆标识);
  3. 闭合翻盖至水平位置,听到「咔嗒」锁定声即完成装配。

四、环境适应性与可靠性

1. 宽温工作范围

  • 工作温度覆盖**-25℃~+85℃**,满足户外使用的智能手环(温差波动)、小型工业传感器(低温环境)等场景需求;
  • 存储温度范围为-40℃~+105℃,适配极端运输/存储环境。

2. 电气与机械可靠性

  • 电气性能:触点镀锡/镀金工艺,接触电阻≤20mΩ,绝缘电阻≥1000MΩ,保障信号传输无衰减;
  • 抗振抗冲击:主体与触点结构经过振动测试(10~2000Hz,1G加速度),可适配运动相机、蓝牙耳机等移动设备的日常振动场景。

五、典型应用场景

1. 消费电子终端

  • 智能手机:副板(电池、摄像头)与主板的FFC连接,1.5mm板高适配内部紧凑空间;
  • 智能穿戴:智能手表屏幕→主板、血氧传感器→主板的FPC连接,翻盖式装配提升生产效率;
  • 蓝牙耳机:充电盒与耳机的内部电路连接,小尺寸适配耳机腔体空间。

2. 便携式设备

  • 运动相机:防水壳内部电路互联,宽温范围适应户外温差(-10℃~+60℃);
  • 便携式医疗:小型血糖监测仪的模块连接,可靠锁定防止脱落。

3. 智能家居与小型家电

  • 智能传感器:温湿度传感器、人体感应传感器的模块连接,卧贴设计适配小PCB;
  • 小型家电:智能台灯、扫地机器人的内部电路连接,高可靠性保障长期使用。

六、总结

F0502-B-08-15T-R以「小型化、易装配、高可靠」为核心,精准匹配当前电子设备「轻薄化、高密度」的设计趋势,是消费电子、便携式设备等领域的高性价比连接方案,可有效降低终端产品的装配成本与空间占用。

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