WMSIC Electronic Components

XFCN M0800VS-08-GN M0800VS

ModelM0800VS-08-GN
PackageSMD,P=0.8mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 175945

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M0800VS-08-GN
Type
XFCN
Minimum package
2000 卷

Technical parameters

Electronic Component
XFCN
Electronic Component
M0800VS-08-GN
Electronic Component
1
Package
SMD,P=0.8mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.074g
Electronic Component
0.8mm
PIN
8P
Electronic Component
1
Electronic Component
BM0265802440
Electronic Component
Electronic Component
Pin
1x8P
PIN
8
Electronic Component
Electronic Component
Electronic Component
UL94V-0

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M0800VS-08-GN线对板针座产品概述

M0800VS-08-GN是兴飞电子(XFCN)推出的一款小型化线对板连接针座,针对高密度PCB设计场景优化,具备紧凑结构、可靠性能及表面贴装适配性,可满足消费电子、工业控制等多领域的线缆与PCB板电连接需求。

一、产品核心定位与基本规格

该型号为单排8Pin线对板针座,核心规格明确:

  • 插针布局:1×8P(单排8针),无多排冗余设计,最大化节省安装空间;
  • 间距参数:针脚中心距0.8mm,属于小型化间距范畴,适配高密度PCB布线;
  • 安装方式:立贴式SMD(表面贴装),无需PCB穿孔,兼容自动化贴装工艺;
  • 品牌与认证:由XFCN(兴飞)出品,阻燃等级符合UL94V-0标准,满足安全合规要求。

二、关键性能与材质特性

(一)电气与接触可靠性

触头采用磷青铜材质,具备以下优势:

  1. 导电性能优异:磷青铜的低电阻率保障信号/电流传输损耗小;
  2. 弹性与耐磨损:材料弹性佳,插拔过程中触头形变恢复性好,可承受多次连接/断开操作;
  3. 防氧化稳定性:表面常规镀锡处理(适配磷青铜特性),可降低长期使用中的氧化风险,保持稳定接触电阻。

(二)机械与结构参数

  • Z轴高度(板上高度):1.7mm,立贴安装后整体厚度薄,适配设备内部狭小空间;
  • Y轴底边宽度:2.7mm,针座本体宽度紧凑,进一步减少PCB占用面积;
  • 阻燃性能:UL94V-0级,属于高阻燃等级,在电子设备中可有效降低火灾风险,符合工业与消费电子的安全标准。

三、适配场景与应用价值

M0800VS-08-GN的小型化、立贴设计使其适用于对空间要求严苛的设备,典型应用场景包括:

  1. 消费电子终端:智能手机、智能手表、蓝牙耳机充电盒等小型便携设备的内部信号/电源连接;
  2. 小型家电与IoT设备:智能音箱、智能家居传感器(温湿度、人体感应)、微型智能门锁的PCB与线缆连接;
  3. 工业控制模块:小型PLC(可编程逻辑控制器)、传感器节点、微型电机驱动板的接口连接;
  4. 汽车电子辅助系统:车载小型摄像头、胎压监测传感器、中控面板辅助模块的内部连接(适配汽车电子小型化需求)。

其核心价值在于:通过紧凑的1×8P布局与0.8mm间距,在有限空间内实现8路信号/电源连接,同时立贴SMD工艺简化PCB设计(无需穿孔),提升生产效率。

四、安装与使用注意事项

  1. 贴装工艺适配:需配合标准SMD贴装设备(如回流焊),焊接温度需符合磷青铜触头的焊接参数(常规建议:回流焊峰值温度230-250℃,时间≤30s);
  2. 清洁与防护:焊接后可采用常规PCB清洁工艺(如酒精擦拭),避免助焊剂残留影响接触;长期使用需注意避免液体侵入针座内部;
  3. 插拔操作规范:插拔时需垂直于针座方向施力,避免倾斜导致触头变形,保障长期可靠性。

五、总结

M0800VS-08-GN作为一款小型化单排立贴针座,以紧凑结构、可靠接触、合规阻燃为核心优势,精准匹配高密度PCB设计的连接需求,是消费电子、工业控制等领域小型设备内部连接的实用选择。

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