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XFCN F0501-B-40-20T-R F0501
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XFCN F0501-B-40-20T-R
- Type
- XFCN
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XFCN
- Electronic Component
- F0501-B-40-20T-R
- Electronic Component
- 1
- Package
- SMD, P=0.5mm
- Electronic Component
- FFC / FPC Connector
- Electronic Component
- 0.786g
- Electronic Component
- 0.5mm
- Electronic Component
- 1
- Electronic Component
- BM0265820700
- Electronic Component
- Electronic Component
- Operating Temperature
- 25℃~+85℃
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- 40P
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
F0501-B-40-20T-R FFC/FPC连接器产品概述
兴飞（XFCN）推出的F0501-B-40-20T-R是一款针对高密度小型化电子设备设计的FFC/FPC连接器，聚焦小间距集成、低空间占用、快速装配三大核心需求，广泛适配消费电子、可穿戴、工业控制等领域的排线连接场景，平衡性能与成本控制。
一、产品定位与核心特性
该连接器定位于中低端小信号传输场景，核心优势集中在“便捷性+空间效率”：
- 40Pin触点+0.5mm间距，单排线可传输40路信号，满足多模块集成需求；
- 抽屉式锁定结构，无需工具即可完成排线插拔，适配批量生产；
- 下接卧贴SMD设计，板上高度仅2mm，完美适配超薄设备内部布局；
- 磷青铜触头+锡镀层，兼顾导电性能与成本控制，符合中低端产品定位。
二、关键参数与性能指标
参数项 规格 应用意义 触点数量 40Pin 单排线最大传输40路小信号（如数据、电源） 间距 0.5mm 小间距缩小连接器整体尺寸，适配高密度布局 安装方式 卧贴SMD 表面贴装适配自动化回流焊，减少手工焊接误差 板上高度 2mm 低profile（薄型设计），节省设备垂直空间30%以上 触头材质 磷青铜 弹性回复性好，插拔500次仍保持接触压力 触头镀层 锡 焊接兼容性优，润湿性好，避免镀金高成本 工作温度 -25℃~+85℃ 覆盖常规运输（冬季低温）与使用（夏季高温）环境 额定电压 50V AC/DC 满足小信号传输电压上限，避免过载 额定电流 400mA 单Pin最大承载电流，总电流需合理分配（如40Pin总电流≤16A，需结合排线规格）三、设计特点与结构优势
1. 抽屉式锁定：无工具快速插拔
传统FFC连接器多采用上掀锁扣，需手动抬起锁扣再插入排线；而F0501-B-40-20T-R的抽屉式结构仅需轻推排线即可锁定，拔出时轻拉排线解锁，无需螺丝刀、镊子等工具，可将产线装配时间缩短40%，尤其适合批量生产场景。
2. 下接卧贴：适配超薄设备
下接触点设计（排线从连接器下方插入）+ 卧贴SMD安装，使连接器在PCB板上的垂直占用高度仅2mm，比同类上接连接器节省约40%的垂直空间，可完美适配智能手表、蓝牙耳机等厚度≤10mm的超薄设备内部布局。
3. 触头优化：平衡性能与成本
磷青铜触头兼具弹性回复性（接触压力稳定，减少接触电阻波动）与导电率（接触电阻≤20mΩ），锡镀层则避免了镀金的高成本，同时保证焊接时的润湿性，减少虚焊风险，适合中低端消费电子的成本控制需求。
四、典型应用场景
- 消费电子：智能手机/平板的电池排线、屏幕排线连接（40Pin可覆盖多通道数据+电源信号）；
- 可穿戴设备：智能手表的主板与屏幕、心率传感器模块的排线连接（低高度适配超薄机身）；
- 小型家电：智能音箱、遥控器的内部模块排线（温区满足家庭使用环境）；
- 工业控制：小型传感器模块（如温度、湿度传感器）与控制板的排线连接（小间距适合多传感器集成）。
五、可靠性与环境适应性
- 温度稳定性：-25℃~+85℃的工作范围，可覆盖中国南北地区的运输（冬季-20℃左右）与使用（夏季室内35℃、户外40℃）环境；
- 抗腐蚀能力：锡镀层在常规环境（湿度≤60%、无腐蚀性气体）下可稳定工作3年以上，满足产品生命周期需求；
- 插拔寿命：抽屉式结构配合磷青铜触头，插拔寿命可达500次，符合行业通用标准；
- 焊接可靠性：卧贴SMD设计适配回流焊工艺，焊点与PCB板贴合紧密，无引脚虚焊问题，良率可达99.5%以上。
该连接器以高性价比、小尺寸、便捷装配为核心竞争力，是中低端电子设备排线连接的优选方案，可满足大多数常规小信号传输场景的需求。
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