WMSIC Electronic Components

XFCN F1002-B-08-20T-R F1002

ModelF1002-B-08-20T-R
PackageSMD, P=1mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN F1002-B-08-20T-R
Type
XFCN
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
F1002-B-08-20T-R
Electronic Component
1
Package
SMD, P=1mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.397g
Electronic Component
1mm
Electronic Component
5
Electronic Component
BM0265820699
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
8P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F1002-B-08-20T-R FFC/FPC连接器产品概述

一、产品核心定位

F1002-B-08-20T-R是XFCN(兴飞)推出的小间距轻薄型FFC/FPC连接器,专为便携电子、小型消费电子等对空间紧凑性、安装便捷性有严格要求的场景设计。产品聚焦8Pin(8P)连接需求,以1mm间距、2mm板上高度为核心优势,兼顾可靠锁定与高密度布局,适配主流柔性线缆规格,是中高端便携设备内部连接的实用选择。

二、关键技术参数详解

该连接器的核心参数直接指向轻薄化与适配性需求,具体如下:

  • 触点数量:8Pin(8P),满足基础信号/电源连接需求;
  • 间距规格:1mm(P=1mm),属于小间距设计,可在有限空间内实现多Pin布局;
  • 安装方式:卧贴SMD(表面贴装),无通孔设计,节省PCB空间且适配自动化生产;
  • 锁定方式:翻盖式,操作简单且锁定可靠;
  • 触点类型:下接式,柔性线缆从连接器下方接入,不占用上方空间;
  • 适配线缆:接入柔性电缆厚度0.3mm,兼容常见0.3mm厚FFC/FPC线缆;
  • 板上高度:仅2mm,可有效压缩设备内部堆叠高度,满足轻薄化设计要求。

三、结构设计与优势

1. 翻盖式锁定:便捷+可靠双兼顾

翻盖式设计是该产品的核心亮点之一:插拔时只需翻开翻盖即可插入线缆,闭合后自动锁定,无需额外工具,操作效率高;同时翻盖结构可紧密固定线缆,避免设备振动、晃动导致的线缆脱落,提升连接可靠性。

2. 下接触点+卧贴封装:空间极致利用

  • 下接触点:线缆从连接器底部接入,上方无突出结构,适合设备内部空间紧张的布局(如智能手表的表带与主体连接);
  • 卧贴SMD:表面贴装工艺无需PCB钻孔,节省通孔空间,且焊接后连接器与PCB贴合紧密,板上高度仅2mm,可适配“毫米级”空间需求。

3. 1mm小间距:高密度连接基础

1mm间距的设计让8Pin布局更紧凑,在相同PCB面积内可实现更多连接,适配小型化设备的高密度信号传输需求(如TWS耳机的内部模块连接)。

四、典型应用场景

该产品的参数与设计特性决定了其在轻薄型移动设备中的广泛适配性,典型场景包括:

  1. 便携穿戴设备:智能手表、运动手环的主体与屏幕/传感器模块连接;
  2. 小型消费电子:TWS蓝牙耳机、充电盒的内部模块连接,便携式蓝牙音箱的信号传输;
  3. 车载小模块:车载中控的小型传感器(如温度、湿度传感器)与主板连接;
  4. 医疗便携设备:便携监护仪、家用血糖仪的内部柔性线缆连接。

五、安装与可靠性保障

1. 安装便捷性

  • 插拔操作:翻盖式结构无需工具,线缆插入后闭合翻盖即可完成锁定,适合批量生产;
  • 焊接工艺:卧贴SMD适配回流焊,与PCB贴合紧密,焊接缺陷率低,可提升生产效率。

2. 可靠性表现

  • 触点性能:采用优质合金触点,接触电阻低(≤50mΩ),保证信号传输稳定;
  • 插拔寿命:支持≥500次插拔循环,满足设备生命周期内的连接需求;
  • 环境适应性:耐温范围适配回流焊(260℃/10s),抗振动(10-2000Hz,1g)、抗冲击(100g/11ms),适合移动设备的使用场景。

3. 适配兼容性

严格匹配0.3mm厚FFC/FPC线缆,避免线缆厚度不匹配导致的接触不良或锁定失效,兼容市场主流柔性线缆品牌。

六、品牌与品质说明

XFCN(兴飞)作为国内专注于连接器研发与生产的厂商,F1002-B-08-20T-R符合RoHS、REACH等环保标准,批量生产一致性好;产品通过可靠性测试(如高低温循环、盐雾测试),可满足中高端客户的品质要求;同时厂商提供完善的供应链支持,可快速响应小批量至大批量的订单需求。

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