Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XFCN PZ200V-11-08P PZ200V
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XFCN PZ200V-11-08P
- Type
- XFCN
- Minimum package
- 1000 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XFCN
- Electronic Component
- PZ200V-11-08P
- Electronic Component
- 2mm
- Electronic Component
- 1
- Package
- Through-hole, P=2mm
- Electronic Component
- Electronic Component
- Electronic Component
- Pin Header
- Electronic Component
- 0.237g
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0265157459
- Electronic Component
- Through-hole
- Operating Temperature
- 40℃~+105℃
- PIN
- 8P
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PZ200V-11-08P 排针产品概述
一、产品基本定位
PZ200V-11-08P是兴飞（XFCN）品牌推出的2mm间距单排直插方针排针，型号命名直接对应核心参数：“11”代表单排结构，“08P”明确总PIN位数为8，属于插件式连接器范畴。其设计聚焦紧凑空间下的可靠连接，是电子设备内部信号/电源传输的常用组件。
二、核心结构与尺寸参数
- 插针与排数：采用单排1×8P设计，针型为方针（区别于圆针）——方针的接触面积分布更均匀，插合时不易滑动偏移，能提升长期接触稳定性，减少信号传输损耗；
- 间距与关键尺寸：标准2mm针距（符合行业通用规范，适配多数2mm排母），塑料基座（塑高）仅2mm，配合针长度3.9mm（与排母插合的有效长度），端接针长度2.8mm（插入PCB板焊接的长度），整体尺寸紧凑，适合小型化设备；
- 安装方式：直插式插件，需通过焊接固定于PCB板，支持手工焊接或波峰焊工艺，适配常规1.6mm厚度PCB板（端接针长与板厚匹配，焊接后针脚露出高度合理）。
三、材质与性能参数
- 触头材质：采用黄铜作为触头基材——黄铜导电性优异（电阻率低），表面耐氧化性能较好，能避免长期使用中接触电阻增大，保证信号/电源传输的可靠性；
- 工作温度范围：-40℃~+105℃，覆盖工业级、消费电子及部分户外场景需求（如低温环境的户外传感器、高温环境的车载辅助模块）；
- 绝缘部分：塑料基座为黑色，材质通常为耐高温工程塑料（如PA66），符合工作温度要求，且黑色耐老化性能优于浅色，能延长产品使用寿命。
四、适配与典型应用
- 适配要求：需匹配2mm间距单排8P方针排母使用，若选用圆针排母会导致接触不良；需确认PCB板焊盘间距为2mm，避免焊接偏移；
- 典型应用场景：
- 智能家居：智能网关、传感器模块的内部子板连接；
- 工业控制：小型PLC、传感器节点的信号传输；
- 消费电子：智能音箱、遥控器、小型家电的内部排线；
- 通信设备：小型基站子板、光模块的辅助连接。
五、选型与使用注意事项
- 匹配性核对：除排母规格外，需确认应用场景是否需要方针（若需圆针则不适用）；
- 安装空间预留：需预留至少2mm（塑高）+ 端接针露出高度的空间，避免与其他组件干涉；
- 焊接工艺控制：直插式焊接时，需控制温度不超过工程塑料耐受极限（避免长期105℃以上加热），手工焊接时间建议不超过3秒/针，防止基座变形；
- 环境评估：若场景存在强腐蚀（如海边、化工环境）或极端温度（超出-40~105℃），需补充防护措施或更换适配产品。
该产品以高性价比、紧凑尺寸和可靠性能，成为小型电子设备内部连接的常用选择，能满足多数常规场景的信号/电源传输需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
