WMSIC Electronic Components

XFCN T34001

ModelT34001
PackageThrough-hole
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN T34001
Type
XFCN
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
T34001
Electronic Component
1
Package
Through-hole
Electronic Component
PCBSolder Terminal Block
Electronic Component
1.642g
Electronic Component
5
Electronic Component
BM0265133179
Electronic Component
Through-hole
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
8.4mm
Electronic Component
4
Electronic Component
Electronic Component
Current
30A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T34001 产品概述

一、产品概况

T34001 由兴飞(XFCN)生产,是一款插件式(带螺丝)的单位顶入式电源接线端子,针对需要稳固大电流连接的印制板(PCB)应用设计。该端子采用黄铜本体并作锡镀处理,具备良好的导电性与抗腐蚀性。产品为通过孔(插件)封装,顶端连接方向,便于从电路板上方进行导线接入与固定,既适合人工装配也适合波峰焊等传统插件工艺。

主要规格一览:

  • 额定电流:30A
  • 焊脚数量:4
  • 焊脚间距(相邻):5 mm
  • 本体高度:8.4 mm
  • 本体材质:黄铜
  • 表面处理:镀锡
  • 可连接位数:1(单位位)
  • 连接方向:顶部(top-entry)
  • 封装形式:插件(through-hole)

二、关键性能与设计亮点

  • 高电流承载能力:额定电流30A,适用于中高电流的电源输入/输出、负载连接等场景。黄铜本体保证低接触电阻与良好导电性,配合合理的端子结构可稳定传导大电流。
  • 多焊脚稳固固定:4 个焊脚设计相比单脚端子在机械强度上有明显提升,能增强端子在焊接后对拔扯和振动的抵抗能力,适合需要可靠机械支撑的应用。
  • 标准化间距与PCB兼容:相邻焊脚间距为 5 mm,便于在常见 PCB 布局规则中规划占位,适配常用钻孔/过孔加工工艺。
  • 表面锡镀处理:镀锡提高焊接性与抗氧化能力,有助于稳定长期接触性能并提升波峰/手工焊质量。
  • 顶部接线,使用便捷:顶入式(顶部连接)结构便于现场接线与维护,配合螺丝固定能保证导线与端子的可靠接触。

三、典型应用场景

T34001 适用于需要板对线、大电流连接与可靠固定的各类电子与电力设备,包括但不限于:

  • 开关电源与直流/交流分配模块
  • 工业控制器、电机驱动器与伺服系统
  • LED 照明电源、车载电源模块
  • 家用电器电源端子、充电设备
  • 电池管理系统(BMS)与电源汇流板

四、安装与焊接建议

  • 焊接工艺:产品为插件型,兼容波峰焊和手工/波峰预处理。建议按 PCB 制造与装配工艺规范选择合适的焊接参数与助焊剂类型,确保锡焊润湿良好并避免长时间高温暴露。
  • 焊盘与机械支撑:为发挥 4 焊脚的机械优势,PCB 上应为每个焊脚设计合适的过孔和焊盘,确保焊锡填充与牢固性。若电流路径有热量集中需求,可在焊盘背面做加铜或接地平面以增强散热。
  • 接线方式:推荐使用压接端子(压接端子套)或绞线并加装线端套(ferrule)后入端子,以获得更稳定的接触面并减少接触电阻和螺丝磨损。
  • 拧紧要求:应使用合适的力矩螺丝刀拧紧端子螺丝,避免过紧导致螺纹或端子变形,也避免过松引起接触不良。具体扭矩值应依据螺丝规格与线缆截面积参照装配规范执行。
  • 清洁与维护:长期运行环境下建议定期检查端子接触面及螺丝紧固情况。如有氧化或污染,可在断电情况下清理并重新拧紧。

五、可靠性与安全性提示

  • 导体与散热:黄铜本体与锡镀层提供良好导电性能,但在持续近额定电流工作时应考虑温升与散热设计,建议在电路板布局中预留散热铜箔或通风空间。
  • 防腐蚀措施:锡镀层可减缓氧化,但在潮湿或腐蚀性环境中仍需采取额外防护(如涂覆防护漆或置于密封腔体内)。
  • 机械疲劳:多焊脚设计提升了抗振动性能,但在频繁插拔或受力冲击场合仍建议进行加固或采用锁紧措施。

六、选型与采购参考

选择 T34001 时,应核对系统电流需求、导线截面积与接线方式,确认 30A 额定能够覆盖峰值与连续电流要求。结合 PCB 布局确认 5 mm 焊脚间距与 4 焊脚占位是否满足板面空间与机械强度需求。兴飞(XFCN)品牌在常规电子元器件供应渠道有稳定供货与技术支持,建议向授权代理或供应商咨询可得的包装单位、最小起订量与定制服务(如特殊镀层或耐温工艺)等信息。

以上为 T34001 的概述与应用建议,适用于在板端实现安全、稳固的大电流连接场景。如需具体的 PCB 尺寸图、焊接工艺参数或机械尺寸图纸(3D 模型/STEP),可向供应商索取详细数据表以便在设计和生产中精确应用。

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