WMSIC Electronic Components

XFCN PZ254V-12-20P PZ254V

ModelPZ254V-12-20P
PackageThrough-hole, P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PZ254V-12-20P
Type
XFCN
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PZ254V-12-20P
Electronic Component
2.5mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
2.54mm
Electronic Component
1.13g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264908713
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PZ254V-12-20P 排针产品概述

一、产品基本定义

PZ254V-12-20P是兴飞(XFCN)品牌推出的通用型双排方针插件排针,采用2.54mm标准间距设计,总引脚数为20P(2排×10针),属于电子设备内部模块、板卡间的信号/电源连接核心组件。该产品通过直插式安装适配PCB插件焊接工艺,具备结构紧凑、导电稳定、耐温范围宽等特点,可覆盖工业、消费电子、通信等多场景互联需求。

二、核心规格参数

2.1 引脚与结构参数

  • 排数:双排(2P)
  • 每排针数:10P
  • 总PIN位数:20P
  • 引脚类型:方针
  • 中心间距(P):2.54mm
  • 行间距(两排引脚中心距离):2.54mm

2.2 尺寸参数

  • 配合针长度(插入对配连接器的部分):6mm
  • 塑壳高度:2.5mm
  • 端接针长度(插入PCB焊盘的部分):3mm

2.3 材质与性能参数

  • 触头材质:黄铜(Cu)
  • 工作温度范围:-40℃ ~ +105℃
  • 塑壳颜色:黑色
  • 安装方式:直插(插件)
  • 封装规格:P=2.54mm标准插件封装

三、结构与材质特性

3.1 引脚设计优势

采用方针结构替代传统圆针,接触面积提升约30%,可有效降低接触电阻(实测≤10mΩ),减少信号传输损耗;双排布局支持多通道信号/电源并行传输,无需额外扩展单排排针,节省PCB布局空间。

3.2 材质可靠性

  • 黄铜触头:导电率高(约1.07×10⁷ S/m),抗氧化性优于普通铜材,长期使用不易形成氧化层,避免接触不良;
  • 黑色塑壳:采用耐高温工程塑料,机械强度稳定,耐温范围与工作温度完全匹配,极端环境下(如高温老化、低温冲击)无变形开裂风险。

3.3 尺寸适配性

  • 配合针6mm:满足板间(或排母)连接深度需求,避免松动;
  • 端接针3mm:适配标准PCB焊盘厚度(1.6mm),焊接时焊料浸润充分,提升焊接强度;
  • 塑高2.5mm:轻薄设计,适合紧凑电路布局(如小型消费电子、便携式设备),不占用垂直空间。

四、典型应用场景

PZ254V-12-20P因规格通用、性能稳定,广泛应用于:

  1. 工业控制:PLC、传感器模块、伺服驱动器的板间互联;
  2. 消费电子:智能音箱、扫地机器人、手持终端的内部电路连接;
  3. 通信设备:路由器、交换机、光模块的接口扩展;
  4. 仪器仪表:示波器、万用表的信号采集/输出接口;
  5. 汽车电子:车载辅助系统(倒车雷达、行车记录仪)的模块连接(适配-40℃~+105℃车载环境)。

五、品牌与品质保障

兴飞(XFCN)专注连接器研发生产10余年,PZ254V-12-20P符合RoHS环保标准,所有参数经严格测试(接触电阻、耐温老化、插拔寿命≥500次),批量生产一致性达标。产品适配手工焊、波峰焊等主流工艺,焊接后无虚焊、假焊问题,长期可靠性高。

该产品以高性价比、稳定性能成为电子互联领域的通用选择,可满足不同行业客户的标准化连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.