WMSIC Electronic Components

XFCN PM254V-12-04-H85 PM254V

ModelPM254V-12-04-H85
PackageThrough-hole, P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PM254V-12-04-H85
Type
XFCN
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PM254V-12-04-H85
Electronic Component
8.5mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
2.54mm
Electronic Component
0.402g
Electronic Component
2.54mm
Electronic Component
5
Electronic Component
BM0265136715
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
Electronic Component
4P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PM254V-12-04-H85排母产品概述

PM254V-12-04-H85是XFCN(兴飞)品牌推出的一款双排直插式方孔排母,采用行业通用2.54mm间距设计,聚焦中小功率电路的稳定连接需求,兼具紧凑结构与高可靠性,适配多种电子设备的内部连接场景。

一、核心参数与基本定位

该排母的核心参数明确了应用边界:

  • 孔位布局:双排2列×2行,总孔位数4P,布局紧凑;
  • 间距规格:引脚中心距2.54mm(行间距同步2.54mm),符合国际PCB设计标准;
  • 安装方式:直插式插件封装,需PCB穿孔焊接固定;
  • 插孔类型:方孔结构,提升接触稳定性;
  • 塑壳高度:8.5mm,控制整体体积的同时保证结构强度。

其基本定位为小型化通用连接组件,避免大尺寸排母的空间浪费,适配对紧凑性、电流承载有要求的电路设计。

二、结构设计细节

1. 孔位与间距设计

双排2×2P布局,既满足多信号/电源并行传输,又将PCB占用面积控制在约10mm×10mm;2.54mm中心距与行距完全对齐,可直接对接同规格排针,无需额外调整PCB布局,降低设计成本。

2. 方孔插孔优势

区别于常规圆孔,方孔结构具备三大优势:

  • 插拔时与排针接触面积更均匀,减少接触电阻;
  • 机械连接更紧密,降低振动环境下的松动风险;
  • 加工精度易控制,保证每排母孔位一致性。

3. 直插安装特点

直插式插件需焊接于PCB穿孔,相比贴片排母连接强度更高,适合振动、冲击场景;支持波峰焊/手工焊,适配不同生产工艺。

三、电气性能与额定参数

该排母满足中小功率电路核心需求:

  • 额定电流:3A(单孔),可同时传输多路中小电流(如控制信号+电源),无需额外并联;
  • 额定电压:250V AC/DC,覆盖家用/工业低压电路常见电压(12V/24V/110V/220V);
  • 接触可靠性:方孔结构+黄铜基材(表面镀锡/镀金提升抗氧化性),接触电阻≤20mΩ,长期使用无明显发热或信号衰减。

四、环境适应性与可靠性

1. 宽温工作范围

工作温度覆盖**-40℃~+105℃**,适配:

  • 低温场景:北方户外设备存储/启动;
  • 高温场景:小型家电内部连续工作(多数家电内部温度≤100℃)。

2. 材料与寿命

塑壳采用耐高温工程塑料(PA66/PBT),耐冲击抗老化;导电部分为优质黄铜,表面处理符合RoHS标准,插拔寿命≥500次,满足设备全生命周期需求。

五、典型应用场景

该排母适配多领域场景:

  1. 智能家居:智能开关、温湿度传感器与控制器的对接;
  2. 工业控制:小型PLC I/O接口、电机驱动板辅助连接;
  3. 消费电子:机顶盒、路由器内部模块连接,小型家电控制板;
  4. 便携式设备:手持测试仪器、小型医疗设备信号传输。

六、品牌与品质保障

XFCN(兴飞)作为国内连接器专业制造商,该产品具备:

  • 标准化生产:每批次经电流、电压、接触电阻及高低温测试,一致性达标;
  • 环保合规:符合RoHS 2.0、REACH指令,无有害物质;
  • 定制支持:提供特殊镀层、塑壳颜色等定制服务,适配客户需求。

综上,PM254V-12-04-H85排母以紧凑结构、可靠性能与通用兼容性,成为中小功率电路连接的优选组件,覆盖消费电子到工业控制多领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.