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P2501L-05-N0是XFCN(兴飞)推出的一款紧凑式胶壳产品,专为2.5mm间距的线对板/线对线连接需求设计,以单排5PIN布局实现空间高效利用,同时通过带锁扣结构保障连接可靠性,广泛适配各类小型电子设备的内部连接场景。
该产品的核心技术参数明确,适配常规电子连接系统需求:
紧凑单排布局
采用1排5PIN的单排结构,相比多排设计节省30%以上的安装空间,适配智能手环、小型传感器模块等微型设备的内部连接。
带锁扣防脱落
集成的弹性锁扣机构在连接时可实现“咔哒”锁定,有效抵抗设备振动、碰撞导致的连接松动,尤其适合便携式或工业振动环境。
无翅简化安装
不带定位翅的设计减少了对电路板定位孔的依赖,可灵活适配导线端压接、电路板表面贴装等多种安装场景,降低装配复杂度。
精准PIN位配合
胶壳内部PIN位槽采用高精度模具成型,与配套端子的配合间隙≤0.05mm,减少接触电阻,保障信号传输稳定性。
主体选用PA66(尼龙66)塑料,该材料赋予产品以下核心性能:
耐温可靠性
工作温度覆盖-25℃至+85℃,可满足冬季户外传感器(如智能门锁温度模块)、夏季车载氛围灯等场景的温度需求。
机械强度优异
拉伸强度≥60MPa,冲击韧性≥5kJ/m²,不易因装配外力或使用中的碰撞开裂,使用寿命较普通ABS材料提升40%。
电气绝缘安全
体积电阻率≥10¹⁴Ω·cm,击穿电压≥20kV/mm,可有效防止相邻PIN位短路,保障电气系统安全。
耐化学腐蚀性
对常见工业溶剂(如酒精、丙酮)、家用清洁剂具有良好耐受性,适合在复杂环境下长期使用。
凭借紧凑尺寸与可靠性能,该产品广泛应用于:
为保障产品性能,使用时需注意:
P2501L-05-N0以高性价比、可靠性能与灵活适配性,成为小间距电子连接场景中的优选胶壳产品,可满足多数常规电子设备的连接需求。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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