WMSIC Electronic Components

XFCN F1003-ZV-10-25T-R F1003

ModelF1003-ZV-10-25T-R
PackageSMD,P=1mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN F1003-ZV-10-25T-R
Type
XFCN
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
F1003-ZV-10-25T-R
Electronic Component
1
Package
SMD,P=1mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.867g
Electronic Component
1mm
Electronic Component
5
Electronic Component
BM0265820783
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
5.5mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
10P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

F1003-ZV-10-25T-R FFC/FPC连接器产品概述

F1003-ZV-10-25T-R是兴飞(XFCN)品牌推出的紧凑型FFC/FPC连接器,专为柔性扁平电缆(FFC)或柔性印刷电路(FPC)的信号/电力传输设计,适配1mm间距、10Pin触点场景,广泛用于小型化电子设备内部连接。

一、产品基本信息

该连接器型号中,“F1003”为系列标识,“ZV”代表单侧垂直触点结构,“10”明确10Pin触点数量,“25T-R”为封装补充标识;品牌为兴飞(XFCN),封装形式为表面贴装(SMD)立贴式,引脚间距1mm,适配0.3mm厚度的柔性电缆,板上安装高度仅5.5mm,可有效节省PCB布局空间。

二、核心电气性能参数

  1. 电压电流规格:额定电压50V(直流/交流通用),单触点额定电流500mA,满足常规信号与小功率电力传输需求;
  2. 温度适应性:工作温度范围为-25℃至+85℃,可适应不同环境温度下的稳定工作;
  3. 触头可靠性:触头采用磷青铜材质(优异导电性、耐磨损性),表面镀锡处理(抗氧化、降低接触电阻),保证长期连接稳定性;
  4. 绝缘性能:符合常规连接器绝缘要求,绝缘电阻≥100MΩ(典型值),防止信号串扰与短路。

三、关键机械特性

  1. 锁定结构:采用抽屉式锁定设计,操作简便,插入柔性电缆后可扣合固定,有效防止电缆松动脱落;
  2. 触点形式:单侧垂直触点结构,配合立贴封装,适配垂直方向电缆连接,节省PCB横向空间;
  3. 尺寸规格:间距1mm、10Pin触点,板上高度5.5mm,接入柔性电缆厚度0.3mm,整体体积小巧,适合高密度布局;
  4. 机械寿命:常规插拔次数≥500次(典型值),满足设备多次装配与维护需求。

四、典型应用场景

该连接器因紧凑尺寸与可靠性能,广泛应用于:

  1. 消费电子:智能手机、平板电脑、智能手表等可穿戴设备的内部柔性连接(如显示屏与主板、电池与主板);
  2. 智能家居:智能音箱、智能门锁、温湿度传感器模块的信号传输;
  3. 小型工业设备:微型PLC、传感器节点、小型仪器仪表的内部连接;
  4. 车载电子:车载小型显示屏、胎压监测传感器、车载摄像头的内部柔性连接(适配-25℃至+85℃车载环境)。

五、安装与使用注意事项

  1. 焊接工艺:立贴SMD封装需采用回流焊,焊接峰值温度≤260℃,单次焊接时间不超过10秒,避免高温损坏;
  2. 电缆适配:必须使用0.3mm厚度的FFC/FPC电缆,插入时确保电缆完全到位,抽屉式锁定扣合紧密;
  3. 环境防护:避免在腐蚀性气体(如硫化物)、高湿度(相对湿度>90%)环境下长期使用;
  4. 插拔操作:垂直方向用力插拔,禁止斜向拉扯,防止触点变形或锁定结构损坏。

六、产品优势总结

  1. 空间高效:1mm间距、5.5mm板高设计,适配小型化设备高密度布局;
  2. 连接可靠:抽屉式锁定+磷青铜镀锡触点,抗振动、防松动,长期稳定;
  3. 宽温适用:-25℃至+85℃工作温度,覆盖大部分消费电子与工业场景;
  4. 操作便捷:单侧垂直触点+抽屉式锁定,安装与插拔简单,降低装配难度;
  5. 成本可控:磷青铜材质与镀锡镀层兼顾性能与成本,适合批量生产。

该连接器凭借紧凑设计、可靠性能与广泛适配性,成为小型电子设备内部柔性连接的优选方案。

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