WMSIC Electronic Components

XFCN PM254V-11-05-H57 PM254V

ModelPM254V-11-05-H57
PackageThrough-hole, P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 177281

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PM254V-11-05-H57
Type
XFCN
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PM254V-11-05-H57
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
0.351g
Electronic Component
2.54mm
Electronic Component
1
Electronic Component
BM0265157210
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
Electronic Component
5P
Socket
Electronic Component
Socket
1x5P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PM254V-11-05-H57 排母产品概述

一、产品核心定位

PM254V-11-05-H57是兴飞电子(XFCN) 推出的单排直插方孔排母,属于通用型板对板/板对线连接器。其针对中低功率电子设备的紧凑空间连接需求设计,兼顾宽温适应性、接触可靠性与成本优势,可覆盖工业控制、消费电子等多领域场景。

二、基础规格参数详解

1. 机械结构

  • 排数与针脚:单排1×5Pin,总孔位数5;
  • 间距:2.54mm(行业通用标准间距,兼容性强);
  • 插孔类型:方孔设计(区别于常规圆孔,接触面积更大);
  • 安装与方向:直插式(插件封装),顶部插孔(便于垂直方向端子/插件连接)。

2. 电气性能

  • 额定电流:3A(连续工作电流,满足小型电机、传感器等负载);
  • 额定电压:250V(交流/直流通用,符合低压电路安全规范);
  • 接触电阻:≤10mΩ(低损耗,确保信号/功率传输稳定)。

3. 环境适应性

  • 工作温度:-40℃~+105℃(覆盖工业级温区,适应户外低温、机房高温);
  • 耐湿度:95%RH(40℃环境下,满足潮湿场景使用)。

4. 品牌与封装

  • 品牌:XFCN(兴飞电子,国内连接器主流厂商,供应稳定);
  • 封装:插件(DIP),适配PCB手工焊接或自动化波峰焊。

三、关键设计优势

1. 方孔结构提升可靠性

方孔与端子的接触面积比圆孔大30%左右,插拔力均匀(1.5~2N),长期使用不易出现接触松动、氧化,降低信号中断风险(尤其适合振动环境)。

2. 标准间距适配性强

2.54mm是连接器行业通用间距,可直接匹配市面上大多数单排端子、排针或配套插件,无需定制设计,缩短研发周期、降低成本。

3. 宽温区覆盖多场景

-40℃~+105℃的工作范围,可覆盖:

  • 工业车间(-10℃~+60℃);
  • 汽车辅助系统(-20℃~+85℃);
  • 户外电子设备(-40℃~+70℃)。

4. 直插封装易生产

插件式安装无需特殊焊接设备,手工焊接或波峰焊均可实现,生产效率高,适合中小批量或大规模量产。

四、典型应用场景

1. 工业控制领域

  • PLC模块I/O接口、传感器节点信号连接;
  • 小型电机驱动板功率输出端(如微型泵、风扇控制)。

2. 消费电子领域

  • 智能家居设备(智能门锁、温湿度传感器)内部连接;
  • 小型家电(加湿器、智能台灯)控制板电路连接。

3. 通信设备领域

  • 小型路由器、交换机的辅助接口(电源输入、状态指示灯);
  • 5G小基站的边缘模块连接。

4. 汽车电子辅助系统

  • 车载胎压监测模块、倒车雷达辅助板内部连接;
  • 车载USB充电模块的板间连接。

五、使用与选型注意事项

1. 配套端子选型

需选择2.54mm间距的单排方孔配套端子(如XFCN同系列TX254端子),避免接触不良或插拔力异常。

2. 焊接工艺要求

  • 波峰焊:温度240℃~260℃,时间≤3秒;
  • 手工焊:温度≤350℃,避免高温导致塑料外壳变形或接触片氧化。

3. 环境防护建议

若使用环境存在腐蚀性气体(如硫化氢、氯气),建议选择带镀金镀层的型号(如XFCN同系列镀金款),或在连接器表面涂覆防护层。

4. 电流降额原则

当工作温度接近105℃时,实际工作电流需降额至2.5A以下,确保长期可靠性;若负载电流超过3A,需选择更高额定电流的型号(如PM254V-11-05-H60,额定电流5A)。

六、总结

PM254V-11-05-H57是一款高性价比、可靠性强的通用排母,适配中低功率电子设备的紧凑空间连接需求,尤其适合对温区、接触稳定性有要求的场景。其标准化设计与成熟工艺,可有效降低研发与生产门槛,是工业控制、消费电子等领域的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.