WMSIC Electronic Components

XFCN M2016V-06P M2016V

ModelM2016V-06P
PackageThrough-hole, P=2mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 177780

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M2016V-06P
Type
XFCN
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M2016V-06P
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.343g
Electronic Component
2mm
PIN
6P
Electronic Component
10
Electronic Component
BM0265820721
Electronic Component
PA66
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃
Pin
1x6P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M2016V-06P线对板针座产品概述

M2016V-06P是XFCN(兴飞)品牌推出的单排直插式线对板针座,专为低压电路中的信号传输与电源连接设计,具备紧凑结构、可靠性能与安全特性,适配多种小型电子设备的接口需求。

一、产品基本信息

该针座采用1×6P单排插针结构,总PIN数为6,引脚间距(Pitch)2mm,属于标准窄间距插件类连接器。安装方式为直插式(DIP),可直接通过插件焊接固定于PCB板上,无需额外工具辅助定位,适配传统插件生产工艺。

二、核心性能参数

2.1 电气性能

  • 额定电流:3A(AC/DC),满足一般低压设备的电源传输与信号导通需求,避免过载风险;
  • 额定电压:250V(AC/DC),符合低压电器安全标准,适配家用及工业低压电路;
  • 接触电阻:锡镀层触头可有效降低接触电阻,确保信号传输稳定无衰减。

2.2 环境适应性

  • 工作温度范围:-25℃~+85℃,覆盖常见室内外环境(如家庭、车间、车辆舱内),低温不脆化、高温不变形;
  • 阻燃等级:UL94V-0,塑料基座遇明火可快速自熄,防止火焰蔓延,符合电子设备安全规范。

2.3 尺寸规格

  • Z轴板上高度:8.1mm,垂直安装空间需求小,适配薄型PCB设计;
  • Y轴板上底边宽度:5.1mm,横向占用面积紧凑,支持PCB高密度布局;
  • 引脚长度适配标准插件焊接孔,无需额外调整孔位。

三、材料与工艺设计

3.1 触头系统

  • 触头基材:黄铜(H62),具备良好的导电性、延展性与机械强度,引脚不易断裂;
  • 触头镀层:哑光锡(Sn),厚度符合行业标准,抗氧化性能优异,长期使用无氧化层脱落,同时提升焊接性(与PCB焊盘兼容性好)。

3.2 塑料基座

  • 材质:PA66(聚酰胺66),耐温性能优异(连续使用温度可达100℃以上),机械强度高(抗冲击、抗弯折),耐化学腐蚀(可耐受常见清洁剂);
  • 成型工艺:精密注塑,引脚定位精度高,无毛刺、变形等缺陷,确保焊接一致性。

四、典型应用场景

M2016V-06P因紧凑尺寸与可靠性能,广泛应用于以下领域:

  1. 小型家电:加湿器、空气净化器、智能台灯的电源/控制信号接口;
  2. 工业控制模块:小型PLC、传感器节点、继电器模组的I/O连接;
  3. 消费电子:蓝牙音箱、智能手环充电接口、便携式充电器的内部连接;
  4. 汽车电子:车载氛围灯、倒车雷达传感器的辅助电路连接。

五、产品优势总结

  1. 紧凑空间适配:2mm窄间距+小尺寸设计,满足PCB高密度布局需求,适合小型化电子设备;
  2. 可靠连接性能:黄铜触头+锡镀层组合,接触电阻低、焊接牢固,长期使用无松动或信号中断;
  3. 安全阻燃设计:UL94V-0阻燃塑料基座,符合电子设备安全标准,降低火灾风险;
  4. 宽温环境兼容:-25℃~+85℃工作范围,适配不同地域与季节的使用环境;
  5. 安装便捷高效:直插式封装,兼容传统插件焊接工艺,生产效率高,无需特殊工装。

该产品凭借稳定的性能与灵活的适配性,成为小型电子设备接口设计的优选连接器之一,可满足多数低压电路的连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.