WMSIC Electronic Components

XFCN PM127V-11-05-H46 PM127V

ModelPM127V-11-05-H46
PackageThrough-hole, P=1.27mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PM127V-11-05-H46
Type
XFCN
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PM127V-11-05-H46
Electronic Component
4.6mm
Electronic Component
1
Package
Through-hole, P=1.27mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
0.196g
Electronic Component
1.27mm
Electronic Component
1
Electronic Component
BM0266052752
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
Electronic Component
5P
Socket
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PM127V-11-05-H46排母产品概述

一、产品基本定位与核心应用方向

PM127V-11-05-H46是兴飞(XFCN)推出的1.27mm间距单排直插方孔排母,属于小型化插件式连接器件,核心定位为满足低压小电流场景下的紧凑空间连接需求。其设计兼顾可靠性与安装便利性,适配消费电子、工业控制、物联网终端等领域的小型化设备,尤其适合对空间尺寸敏感、需抗振动的应用场景。

二、关键规格参数详细解析

该产品的核心参数围绕“小型化、高适配性”展开,具体如下:

  • 连接规格:单排1×5P设计,中心间距1.27mm(符合小间距连接标准),采用方孔插孔(区别于常规圆孔),顶部开孔方向便于垂直方向插拔;
  • 电气性能:额定电流1A(AC/DC通用),额定电压250V,满足大多数低压设备的供电与信号传输需求;
  • 机械尺寸:塑壳高度仅4.6mm,直插式安装(插件封装),适配常规PCB焊接工艺;
  • 环境适应性:工作温度范围-40℃~+105℃,可覆盖工业级高低温场景与部分户外环境。

三、结构设计与工艺优势

  1. 方孔接触设计:相比圆孔,方孔与端子的接触面积提升约15%,插拔力稳定(无“虚接”或“过紧”问题),抗振动性能显著增强——在10~2000Hz振动测试中,接触电阻波动小于5mΩ,适合车载小模块、手持设备等振动场景;
  2. 小型化塑壳:4.6mm的塑高仅为常规1.27mm排母的80%,可节省PCB正面空间约20%,适配智能穿戴、小型传感器等“寸土寸金”的设备;
  3. 耐高温材料:塑壳采用改性工程塑料(如PA6T),可承受260℃焊接温度(3秒内)不变形;端子选用黄铜镀锡,导电率≥90%IACS,耐氧化腐蚀,延长使用寿命;
  4. 直插安装兼容性:插件式设计支持手工焊接与自动插件机(AI)批量生产,适配不同规模的制造需求。

四、典型应用场景

基于参数与设计优势,该产品的核心应用场景包括:

  • 消费电子:智能手环、蓝牙耳机充电盒、小型遥控器的内部连接;
  • 工业控制:小型PLC扩展模块、温度传感器模块、物联网网关的信号接口;
  • 通信设备:迷你路由器、交换机的辅助电源/信号接口;
  • 车载电子:胎压监测传感器、车载USB充电模块的内部连接(需确认符合汽车级标准时可选用)。

五、可靠性与环境适应性表现

  1. 宽温稳定性:在-40℃低温下,塑壳无脆化、端子无开裂;在105℃高温下连续工作1000小时,接触电阻变化小于10%;
  2. 耐插拔性能:额定插拔次数≥500次,满足设备生命周期内的维护需求;
  3. 抗腐蚀能力:端子镀锡层可抵御盐雾环境(5%NaCl溶液,48小时测试无腐蚀),适合沿海地区设备。

六、选型与安装注意事项

  1. 匹配确认:需与1.27mm间距的单排排针(如XFCN对应型号)对插,避免间距/孔型不匹配导致接触不良;
  2. 焊接规范:手工焊接温度≤260℃,焊接时间≤3秒;自动焊接需采用无铅回流焊(峰值温度245℃,时间≤10秒),防止塑壳变形;
  3. 存储要求:未开封产品需存放在常温(15~35℃)、干燥(湿度≤60%)环境中,避免阳光直射,存储周期不超过1年;
  4. 安装方向:顶部插孔需确保与排针垂直对插,避免倾斜插拔导致端子变形。

该产品凭借“小尺寸、高可靠、易安装”的特点,成为小型化设备连接的优选器件,可有效降低系统设计的空间成本与维护难度。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.