WMSIC Electronic Components

XFCN MF254V-11-04-1000-H70 MF254V

ModelMF254V-11-04-1000-H70
PackageThrough-hole, P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN MF254V-11-04-1000-H70
Type
XFCN
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
MF254V-11-04-1000-H70
Electronic Component
7mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
0.392g
Electronic Component
2.54mm
Electronic Component
1
Electronic Component
BM0265157238
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
Electronic Component
4P
Socket
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MF254V-11-04-1000-H70 排母产品概述

一、产品核心身份与定位

MF254V-11-04-1000-H70是XFCN(兴飞)品牌推出的通用型单排直插圆孔排母,属于2.54mm标准间距连接器系列。产品主打「小体积、高适配、宽温可靠」特性,聚焦电子设备中信号传输+低压小电流电源连接场景,兼容手工焊接、波峰焊等主流插件工艺,是小型电子模块、工业控制、消费电子等领域的基础适配元件。

二、基础参数全解析

产品参数围绕「结构、安装、电气、环境」四大维度设计,关键信息如下:

  • 结构维度:单排1×4P布局(总孔位数4),插孔为圆孔结构(相比方孔接触更均匀,插针配合无卡滞);插孔方向「顶部朝上」(焊接面在底部,适配垂直PCB安装);塑壳高度(塑高)7mm,可支撑紧凑空间设计。
  • 安装维度:直插式(插件)封装,无需特殊工具即可焊接;间距2.54mm为行业通用规格,兼容市场绝大多数2.54mm间距排针(如φ0.6mm标准插针)。
  • 电气维度:额定电流3A(AC/DC通用),额定电压60V(低压安全范围),满足小型设备的信号与小功率电源传输需求。
  • 环境维度:工作温度范围-40℃~+105℃,覆盖工业级、车载级及普通消费电子的温度场景;塑壳采用耐高温工程塑料(推测为PA66),插针为黄铜镀锡(防氧化、抗腐蚀)。

三、关键性能优势

  1. 宽温可靠性:-40℃~+105℃的温度范围,可适应北方低温、工业设备高温及车载温度波动,无需额外温控设计。
  2. 接触稳定性:圆孔插孔与排针配合时,接触面积均匀且弹性适中,避免方孔易出现的「卡针」或「虚接」问题,长期使用接触电阻稳定。
  3. 安装兼容性:直插封装支持手工烙铁、波峰焊及插件回流焊,适配不同生产规模;2.54mm标准间距与主流排针无缝配合,无需定制适配件。
  4. 小体积适配:7mm塑高+单排4P设计,占用PCB面积仅约(4×2.54)×7mm(长×宽×高),适合智能手环、微型传感器等小型化设备。

四、典型应用场景

因参数均衡、适配性强,本产品广泛用于:

  1. 小型电子设备:智能家居传感器(温湿度/人体感应模块)、便携式仪器(万用表扩展口)、玩具控制板(遥控车/无人机)。
  2. 工业控制模块:PLC扩展接口、工业传感器(接近开关/光电开关)信号端、小型继电器控制接口。
  3. 消费电子:小家电控制板(加湿器/台灯电源接口)、音频设备(耳机放大器输入输出)。
  4. 车载电子:低功耗车载设备(行车记录仪辅助电源、胎压监测信号传输)。

五、品牌与品质背书

XFCN(兴飞)是国内专注连接器研发的厂商,产品品质有以下保障:

  • 符合RoHS环保标准(无铅、无镉),适配全球市场;
  • 插针黄铜镀锡工艺,抗氧化能力强,插拔寿命≥500次(超行业标准);
  • 塑壳通过UL94 V-0阻燃认证,降低起火风险;
  • 批量产品经过高低温循环、振动及插拔寿命测试,可靠性符合电子行业通用标准。

六、安装与使用注意事项

为确保性能稳定,需注意:

  1. 焊接工艺:手工焊温度350℃~380℃,单点点焊≤3秒;波峰焊温度260℃±5℃,焊接时间≤5秒,避免高温损坏塑壳。
  2. 插针配合:选用φ0.58~φ0.62mm的2.54mm排针,避免过粗卡针或过细虚接。
  3. PCB设计:焊盘孔径建议φ0.8~φ0.9mm,焊盘间距严格2.54mm,防止安装卡滞。
  4. 环境防护:潮湿/多尘场景需配合密封胶或防护壳,避免插孔进水积尘导致短路。

本产品以「高性价比+稳定可靠性」为核心,是小型电子设备连接的理想选择,可满足不同场景的基础连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.