WMSIC Electronic Components

XFCN MH254V-11-04-1000 MH254V

ModelMH254V-11-04-1000
PackageThrough-hole, P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN MH254V-11-04-1000
Type
XFCN
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
MH254V-11-04-1000
Electronic Component
3mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
0.335g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265746609
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
PIN
4P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MH254V-11-04-1000 排针产品概述

MH254V-11-04-1000是XFCN(兴飞) 推出的一款单排直插圆针排针,属于2.54mm标准间距系列,专为电子设备的信号与电源连接设计,具备紧凑结构、稳定性能与宽温适应性,可满足多领域的基础连接需求。

一、产品基本定位与规格定义

该排针核心定位为中小功率电子设备的标准连接组件,采用单排直插式插件封装,针脚配置为1×4P(单排4位),圆针设计,间距2.54mm(符合行业通用标准,兼容多数PCB焊盘布局)。产品以“高可靠性、紧凑空间利用”为设计核心,适配手工焊接与波峰焊工艺,可快速集成至各类电子模组中。

二、核心参数全解析

1. 针脚与间距

  • 排数:单排;总PIN位数:4P;间距:2.54mm(行业标准间距,与同规格配套连接器完全兼容)。

2. 针型与安装方式

  • 针型:圆针(插拔顺滑,接触稳定性优于部分方针设计);
  • 安装方式:直插式插件(通过端接针插入PCB焊盘焊接固定,工艺简单,可靠性高)。

3. 尺寸细节

  • 配合针长度:3.5mm(确保与配套连接器(如排母)有效配合,避免插拔松动);
  • 塑高:3mm(紧凑设计,节省PCB垂直空间,适配薄型模组或空间受限场景);
  • 端接针长度:3.5mm(焊接时与PCB焊盘的附着面积充足,提升焊接牢固度)。

4. 电气与环境性能

  • 额定电流:3A(满足中小功率信号与电源传输需求,覆盖多数消费电子、工业控制场景);
  • 工作温度:-40℃~+105℃(宽温范围,适应高低温环境,如车载、户外设备等);
  • 外观颜色:黑色(塑壳采用耐高温绝缘材料,耐老化、抗磨损)。

三、结构设计亮点

1. 紧凑单排布局

1×4P单排设计大幅减少PCB占用面积,尤其适合小型化设备(如智能传感器、微型控制器)的内部连接,避免多排结构的空间浪费。

2. 圆针接触优势

圆针设计相比方针具有插拔顺滑性好、接触面积稳定的特点,长期插拔不易产生针脚磨损,可延长产品使用寿命;同时圆针与配套排母的配合间隙更均匀,降低接触电阻波动风险。

3. 合理针长优化

配合针(3.5mm)与端接针(3.5mm)的长度平衡设计,既保证与配套连接器的有效配合深度,又确保焊接时端接针与PCB焊盘的充分浸润,减少虚焊、假焊概率。

4. 低塑高适配性

3mm塑高可适配厚度仅1.6mm的常规PCB,甚至部分薄型PCB(如0.8mm),在模组堆叠设计中能进一步压缩整体高度,提升设备集成度。

四、性能表现优势

1. 宽温环境稳定性

-40℃+105℃的工作温度范围覆盖工业级(-40+85℃)与部分车载场景(-40~+105℃),可在低温启动、高温环境下保持电气性能稳定,不会因温度变化出现塑壳变形或针脚松动。

2. 可靠电流承载

3A额定电流满足多数中小功率电路需求(如5V/2A电源传输、数字信号传输),短期过载(峰值电流)可承受1.5倍额定电流(4.5A),具备安全裕量。

3. 焊接与配合可靠性

直插式插件封装与圆针设计,使焊接工艺兼容性强(手工焊、波峰焊均可);配合针长度足够,插拔时与排母接触面积稳定,插拔次数可达500次以上(行业常规标准),不易出现接触不良。

4. 绝缘与耐老化性

黑色塑壳采用耐高温ABS/PC合金材料,长期使用无异味、不变形,绝缘电阻可达100MΩ以上(1000V DC),有效避免短路风险。

五、典型应用场景

MH254V-11-04-1000因结构紧凑、性能稳定,广泛应用于以下领域:

  1. 消费电子:智能家居传感器(温湿度传感器)、小型家电控制器(加湿器、台灯)、智能穿戴设备(手环充电模组);
  2. 工业控制:小型PLC模块、工业传感器接口(光电传感器)、工业仪表(温度采集仪);
  3. 通信设备:小型路由器/交换机辅助接口、无线模块(WiFi模组)电源连接;
  4. 汽车电子:车载小模块(胎压监测接收器、USB充电接口)内部连接。

六、品牌与品质保障

XFCN(兴飞)作为专注连接器领域的制造商,具备10余年生产经验,产品覆盖排针排母、接插件等全系列,通过ISO9001质量管理体系认证,符合RoHS环保标准。MH254V-11-04-1000生产过程严格管控针脚公差(±0.05mm)、塑壳尺寸(±0.1mm),参数一致性好,可批量稳定供应。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.