WMSIC Electronic Components

XFCN PM200VS-12-08-H43 PM200VS

ModelPM200VS-12-08-H43
PackageSMD,P=2mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 178984

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PM200VS-12-08-H43
Type
XFCN
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PM200VS-12-08-H43
Electronic Component
4.3mm
Electronic Component
1
Package
SMD,P=2mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
2mm
Electronic Component
0.8g
Electronic Component
2mm
Electronic Component
1
Electronic Component
BM0265157401
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃
Electronic Component
8P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PM200VS-12-08-H43 双排立贴连接器产品概述

PM200VS-12-08-H43是兴飞(XFCN)推出的一款紧凑型2mm间距双排立贴SMD连接器,专为小型化、高可靠性电子设备设计,兼顾电气性能与安装灵活性,广泛适配消费电子、工业控制及汽车电子等领域的模块化连接需求。

一、产品核心定位与典型应用

该连接器以“紧凑空间+可靠连接”为核心设计,总孔位数8P(2×4排列),2mm间距符合行业标准紧凑型规格,立贴安装方式可大幅节省PCB横向空间,适合对体积敏感的设备。典型应用场景包括:

  • 消费电子:智能穿戴设备(如智能手表充电/信号接口)、小型智能家居终端(如温湿度传感器模块);
  • 工业控制:小型PLC扩展模块、传感器节点(如压力/温度传感器与控制器的连接);
  • 汽车电子:低功耗辅助系统(如车内氛围灯控制模块、胎压监测子模块)。

二、基础结构与尺寸参数

PM200VS-12-08-H43的结构参数精准适配小型化需求,关键指标如下:

  • 排数与孔位:双排设计,2×4P(共8个插孔),满足多信号/电源并行传输;
  • 间距规格:引脚中心距2mm(行业通用紧凑型间距),双排行距2mm(确保插针插入时的稳定性);
  • 插孔与安装:顶部方孔设计(比圆孔接触更紧密,防插针晃动),立贴(SMD)安装(引脚为表面贴装型,无需PCB钻孔);
  • 塑壳尺寸:塑高4.3mm(塑料主体高度),整体体积小巧,适配薄型设备(如厚度≤5mm的终端产品)。

三、电气性能与环境适应性

该连接器的电气参数覆盖多数实际应用场景,环境适应性强:

  • 额定参数:额定电流2A/孔(满足单孔电源传输需求,多孔并联可提升电流容量),额定电压250V(兼容低压直流与中低压交流系统);
  • 工作温度:-40℃~+105℃宽温范围,可适应极端环境(如北方户外传感器、汽车发动机舱附近模块);
  • 接触可靠性:触头采用磷青铜材质(弹性回复力强,耐插拔磨损),表面镀金镀层(抗氧化、降低接触电阻,减少发热与信号损耗)。

四、材料与工艺特性

从材料选型到加工工艺,均围绕“稳定耐用”设计:

  • 触头材料:磷青铜(CuSn合金),兼具良好导电性与机械弹性,插拔次数可达数千次(行业常规测试标准);
  • 镀层工艺:触头表面镀金(厚度符合行业标准),有效防止氧化,确保长期使用中接触电阻稳定(一般≤20mΩ);
  • 塑壳材料:采用耐高温工程塑料(如PA66或PBT,UL94 V-0阻燃等级),耐温性匹配工作温度范围,同时具备抗冲击、抗老化性能;
  • 加工工艺:触头冲压成型+精密电镀,塑壳注塑成型,引脚SMD设计适配自动化回流焊工艺,生产效率高且一致性好。

五、安装与适配说明

安装灵活且兼容行业标准,便于设备集成:

  • 安装方式:立贴SMD,引脚为表面贴装型,可通过回流焊直接焊接在PCB表面,无需钻孔,节省PCB空间与加工成本;
  • 插孔方向:顶部开口,适合垂直方向插针/连接器配对(如配套的针座垂直插入,节省横向空间);
  • 兼容性:2mm间距符合JEDEC等行业标准,可与同间距的双排针座/连接器互换,方便设备设计时的选型替换;
  • 孔位排列:2×4P的双排排列,可根据需求分配电源(如2孔)与信号(如6孔),适配多通道传输需求。

六、品牌与品质保障

该产品由兴飞(XFCN)生产,作为国内专业连接器制造商,其产品具备以下优势:

  • 环保合规:符合RoHS 2.0、REACH等环保标准,无有害物质;
  • 可靠性测试:经过插拔寿命测试、高低温循环测试(-40℃105℃,循环500次)、振动测试(102000Hz,加速度2g)等,确保恶劣环境下的稳定连接;
  • 批量供应:具备稳定的生产能力,可满足中小批量至大批量订单的交付需求,且产品一致性好。

总结:PM200VS-12-08-H43以紧凑体积、可靠性能与灵活安装为核心优势,适配多种小型化电子设备的连接需求,是消费电子、工业控制等领域的高性价比连接器选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.