WMSIC Electronic Components

XFCN BH254VS-6P BH254VS

ModelBH254VS-6P
PackageSMD,P=2.54mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN BH254VS-6P
Type
XFCN
Minimum package
340 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
BH254VS-6P
Electronic Component
1
Package
SMD,P=2.54mm
Electronic Component
2
Electronic Component
IDCInsulation Displacement Connector(Box Header / Box Header)
Electronic Component
2x3P
Electronic Component
2.54mm
Electronic Component
1.25g
Electronic Component
2.54mm
Electronic Component
1
Electronic Component
BM0265157333
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃
PIN
3

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BH254VS-6P 简牛座产品概述

一、产品核心定位与类型

BH254VS-6P是XFCN(兴飞)品牌推出的IDC刺破式简牛座,属于板端连接器范畴,专为2.54mm间距的多线连接场景设计。该产品需与配套的IDC刺破式线端连接器配合使用,通过刺破式接触实现线缆与PCB的快速、无焊接连接,是中小功率电子设备中基础信号/电力传输的高性价比选择。

二、关键参数与性能规格

该产品核心参数符合行业标准,覆盖多数应用场景的需求:

  • 针脚配置:2排×3针(2x3P),总6针,满足基础多线并行传输需求;
  • 间距规格:2.54mm(0.1英寸),兼容全球通用的连接器间距标准,适配常规线缆与PCB设计;
  • 电气性能:额定电流3A(AC/DC)、额定电压250V(AC/DC),可稳定传输中小功率电力与数字/模拟信号;
  • 温度范围:工作温度-40℃至+105℃,覆盖工业级(-4085℃)与消费级(070℃)设备的环境要求,耐高低温性能优异;
  • 安装方式:表面贴装(立贴SMD),无需在PCB上开设插件孔,适合自动化贴装生产线,提升生产效率。

三、结构设计与封装特点

1. 封装与安装

采用SMD立贴封装,针脚垂直于PCB表面,相比插件式节省30%以上的PCB占用面积,适配高密度布局的小型设备;封装间距P=2.54mm,与针脚间距一致,确保贴装精度。

2. 刺破式(IDC)核心结构

线端连接器通过锋利的金属触点刺破线缆绝缘层,直接与简牛座的金属针脚接触,无需焊接工序:

  • 减少热应力对PCB与线缆的损伤;
  • 单连接过程仅需数秒,大幅缩短装配时间;
  • 接触点紧密,抗振动与松动性能优于传统焊接方式。

3. 材料与工艺

  • 绝缘主体:采用耐高温、耐腐蚀的PA66工程塑料,长期使用无老化变形;
  • 金属针脚:选用高导电率黄铜(或磷青铜),表面镀锡(Sn)处理,提升抗氧化性与接触可靠性;
  • 机械强度:针脚与绝缘主体通过注塑一体成型,插拔寿命可达100次以上,符合工业级连接器标准。

四、适用场景与应用优势

1. 典型应用场景

  • 工业控制:PLC扩展模块、传感器接口、小型电机驱动单元;
  • 消费电子:智能家居控制器、便携式医疗设备、音频/视频设备内部连接;
  • 通信网络:IoT终端模块、路由器/交换机辅助接口、光模块信号连接;
  • 汽车电子:车载小功率传感器(如温度、压力传感器)的板端连接(需确认具体车型的温湿度要求)。

2. 核心应用优势

  • 快速装配:无焊接工序,降低人工成本与装配复杂度;
  • 空间高效:立贴封装适配紧凑设备设计,满足小型化趋势;
  • 宽温可靠:-40~105℃的工作范围,适应户外、工业车间等复杂环境;
  • 标准兼容:2.54mm间距与行业通用,可与其他品牌IDC线端连接器互换使用。

五、品牌与质量保障

XFCN(兴飞)作为专注于连接器领域的厂商,对BH254VS-6P的质量控制覆盖全流程:

  • 符合RoHS环保标准(无铅、无卤),满足欧盟与国内环保要求;
  • 出厂前通过多项测试:绝缘电阻(≥1000MΩ)、接触电阻(≤20mΩ)、耐压测试(1500V AC/1min)、振动测试(10~2000Hz);
  • 提供批量稳定供货,支持小批量定制(如针数调整、镀层升级),适配不同客户的特殊需求。

总结

BH254VS-6P简牛座凭借标准间距、可靠性能、便捷安装三大核心优势,成为中小功率电子设备中板端连接的主流选择。无论是工业控制的稳定性要求,还是消费电子的小型化需求,该产品均能提供高性价比的连接解决方案。

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