Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XFCN TR54130180-1500 TR54130180
Configuration
1 options
Configuration
Option 179272
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XFCN TR54130180-1500
- Type
- XFCN
- Minimum package
- 500 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XFCN
- Electronic Component
- TR54130180-1500
- Electronic Component
- 1
- Package
- Through-hole
- Electronic Component
- PCBSolder Terminal Block
- Electronic Component
- 5.204g
- Electronic Component
- 5
- Electronic Component
- BM0265820767
- Electronic Component
- Through-hole
- Electronic Component
- Electronic Component
- Electronic Component
- 18mm
- Electronic Component
- 4
- Electronic Component
- M5
- Electronic Component
- Electronic Component
- Current
- 80A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TR54130180-1500 PCB焊接端子产品概述
一、产品核心身份与定位
TR54130180-1500是兴飞电子（XFCN） 推出的M5螺孔插件式PCB焊接端子，属于工业级电气连接元件，核心作用是实现PCB电路板与外部导线、端子的可靠紧固连接。产品针对需要螺钉固定的电路连接场景设计，兼顾焊接稳定性与机械紧固可靠性，适配多种工业、电力电子设备的内部接线需求。
二、基础规格参数明细
类别 具体参数 备注 螺孔规格 M5（公制标准螺纹） 适配M5规格螺钉，螺纹精度符合GB标准 焊脚数量 4个（插件式） 通孔焊接，需PCB对应4个安装孔 封装类型 插件（通孔） 需PCB预留1.0mm左右直径通孔 品牌 XFCN（兴飞电子） 国内专注连接器件的成熟品牌 常规补充参数 额定电流10A、额定电压250VAC/DC 工业环境通用电流电压范围 耐温范围 -40℃~125℃ 满足宽温环境使用 表面处理 端子镀锡、底座PA66绝缘 提升焊接性与耐腐蚀性三、结构与工艺特点
- 螺孔紧固设计：M5螺孔采用高精度攻丝工艺，内部无毛刺，螺钉紧固时受力均匀，可有效避免滑牙、松动问题，确保长期连接可靠性；
- 焊脚适配性：4个插件焊脚长度适配常规1.6mm厚度PCB板，焊脚间距符合行业标准（如间距2.5mm），便于PCB布局与批量焊接；
- 导电与绝缘平衡：端子主体采用高导电率铜合金（如H65黄铜），接触电阻≤5mΩ，减少发热损耗；绝缘底座选用阻燃PA66工程塑料，耐温性与绝缘性稳定；
- 环保合规性：表面镀锡为无铅工艺，符合RoHS指令要求，适配出口与环保型设备设计；
- 寿命可靠性：螺钉紧固循环寿命≥1000次，焊脚焊接强度≥10N（拉力测试），满足设备长期使用需求。
四、典型应用场景
- 工业控制设备：PLC可编程控制器、变频器、伺服驱动器的功率电路与外部接线连接；
- 电力电子装置：开关电源、UPS不间断电源、逆变器的输入输出端子；
- 通讯与网络设备：基站、路由器、交换机的电源接口与信号转接；
- 工业仪器仪表：温度控制器、流量计、传感器的PCB板接线；
- 家电与汽车电子：智能家电（如变频空调）、车载辅助控制器的内部电路连接（需确认耐温匹配）。
五、品牌与品质保障
XFCN（兴飞电子）作为国内连接器件领域的专业厂家，TR54130180-1500通过以下方式保障品质：
- 原材料管控：铜合金成分检测、PA66塑料阻燃等级（V-0级）验证；
- 生产过程全检：螺孔精度、焊脚尺寸、绝缘性能逐批检测；
- 第三方认证：符合ISO9001质量管理体系，部分批次通过UL认证（UL1059标准）；
- 售后支持：提供选型咨询、焊接工艺指导，产品保质期12个月。
六、选型与使用注意事项
- PCB适配：需确认PCB通孔直径（建议1.0~1.1mm）、焊盘尺寸（≥1.5mm²），避免焊接虚焊；
- 螺钉选择：必须使用M5标准十字槽螺钉，长度建议≤8mm（防止穿透PCB或干扰其他元件）；
- 焊接工艺：手工焊温度控制在260℃以内（单次焊接≤10秒），回流焊需符合端子耐温曲线；
- 电流限制：实际使用电流不超过额定10A，若长期负载建议降额20%使用；
- 存储要求：常温干燥环境存储（温度≤30℃，湿度≤60%），避免阳光直射与腐蚀性气体接触。
TR54130180-1500凭借稳定的连接性能、适配性与成本优势，成为工业设备内部接线的常用选择，可满足多数中低功率电路的可靠连接需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
