WMSIC Electronic Components

XFCN M3025V-2X6P M3025V

ModelM3025V-2X6P
PackageThrough-hole, P=3mm
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179296

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M3025V-2X6P
Type
XFCN
Minimum package
500 卷

Technical parameters

Electronic Component
XFCN
Electronic Component
M3025V-2X6P
Electronic Component
1
Package
Through-hole, P=3mm
Electronic Component
2
Electronic Component
Wire-to-Board
Electronic Component
3mm
Electronic Component
1.34g
Electronic Component
3mm
PIN
12P
Electronic Component
1
Electronic Component
BM0265820798
Electronic Component
PA66
Electronic Component
Through-hole
Operating Temperature
40℃~+85℃
Pin
2x6P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M3025V-2X6P线对板针座产品概述

M3025V-2X6P是兴飞(XFCN)出品的2排6针直插式线对板针座,采用3mm间距设计,适配中功率电路的信号与电源传输需求,广泛应用于工业控制、家电、通讯等领域。以下从核心参数、材料工艺、适用场景等维度展开详细介绍:

一、产品核心规格参数

该针座的技术参数清晰明确,满足多数中低端电子设备的基础连接需求:

  • 插针结构:双排设计(2×6P),每排6个针脚,总PIN数12,行距与针距均为3mm;
  • 安装方式:直插式(插件),适配传统PCB板的通孔焊接工艺;
  • 电气参数:额定电压250V(AC/DC通用),工作温度范围-40℃至+85℃,覆盖工业级环境温度;
  • 物理材质:触头为黄铜+镀锡,塑料外壳为PA66(聚酰胺66)。

二、关键材料与工艺特性

产品材料选择兼顾性能与成本,直接决定可靠性与适用场景:

1. 触头:黄铜镀锡

  • 黄铜具有优异导电性能与机械强度,单针最大承载电流约3A(参考同类3mm间距针座);
  • 表面镀锡层提升焊接可焊性,同时增强抗氧化能力,避免长期使用中接触不良;
  • 针脚尺寸精度高,插入PCB通孔后焊接牢固,不易脱落。

2. 外壳:PA66

  • PA66是连接器外壳常用材料,具备耐高低温、机械强度高、UL94 V-0级阻燃特性;
  • 外壳紧密贴合针脚,防止晃动,提升连接稳定性;
  • 耐轻微化学腐蚀,适应工业环境中的油污、酸碱接触。

三、适用场景与性能优势

M3025V-2X6P定位清晰,核心覆盖以下领域:

1. 典型应用场景

  • 工业自动化:PLC控制器、传感器接口、小型电机驱动板的信号/电源连接;
  • 家用电器:空调、洗衣机、油烟机等控制板与线束对接;
  • 通讯设备:小型路由器、光模块、基站辅助模块内部连接;
  • 汽车电子:车载USB模块、小功率传感器(如温度传感器)接口。

2. 核心性能优势

  • 间距适配:3mm间距比2.54mm针座承载电流更强,适合中等功率传输;
  • 安装便捷:直插式设计无需额外工具,波峰焊/手工焊均可快速安装,降低生产效率;
  • 环境适应:-40℃至+85℃温度范围,覆盖户外与工业环境;
  • 成本可控:成熟材料工艺兼顾性能与成本,适合批量量产。

四、品牌与品质保障

兴飞(XFCN)作为国内连接器厂商,产品具备以下保障:

  • 环保合规:符合RoHS 2.0标准,无铅无镉,满足欧盟环保要求;
  • 认证支持:部分批次通过UL认证,可提供检测报告;
  • 批量稳定:自动化生产工艺确保针脚间距、焊接点一致性;
  • 售后支持:提供技术咨询与样品测试,支持小批量定制。

五、安装与使用注意事项

为确保性能与寿命,使用需注意:

  1. 焊接规范:电烙铁温度330℃-350℃,单针焊接时间≤3秒,避免损坏外壳;
  2. 储存条件:常温(15℃-30℃)、干燥(湿度≤60%)环境,避免潮湿/阳光直射;
  3. 插拔要求:垂直插拔,避免斜向用力导致针脚弯曲,建议插拔次数≤50次;
  4. 清洁要求:焊接前保持针座清洁,无油污/灰尘,避免影响焊接质量。

综上,M3025V-2X6P是一款高性价比直插针座,以稳定性能、便捷安装和合理成本,成为工业控制、家电等领域的常用连接元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.