WMSIC Electronic Components

XKB Connectivity X2011WVS-06A-9TSN X2011WVS

ModelX2011WVS-06A-9TSN
PackageSMT
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179659

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2011WVS-06A-9TSN
Type
XKB CONNECTIVITY
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2011WVS-06A-9TSN
Electronic Component
1
Package
SMT
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.3g
Electronic Component
2mm
PIN
6P
Electronic Component
1
Electronic Component
BM0265742906
Electronic Component
PA9T
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Pin
1x6P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2011WVS-06A-9TSN线对板针座产品概述

一、产品基本定位

X2011WVS-06A-9TSN是XKB Connectivity(星坤) 推出的一款小间距线对板SMD针座,核心参数为1x6P(单排6针)、2mm间距,主打紧凑空间适配、高可靠性与自动化贴装,适用于消费电子、小型家电、工业控制等多领域的板端连接场景。

二、核心电气性能参数

该针座的电气指标满足中小功率信号与电源的混合传输需求:

  • 额定电流:3A(单Pin),可支持常规电源供电与信号传输的功率需求;
  • 额定电压:250V AC/DC,符合低压电气系统的安全标准;
  • 接触可靠性:触头采用黄铜(H65)+锡镀层,典型接触电阻≤20mΩ,抗氧化、抗腐蚀性能优异,长期使用不易出现接触不良;
  • 绝缘性能:塑料主体绝缘电阻≥1000MΩ(25℃/500V DC),有效避免串扰与短路风险。

三、机械结构与安装特性

结构设计紧凑且适配自动化生产:

  • 布局规格:1排6针(1x6P),针间距2mm,属于小间距连接器范畴,可节省PCB板空间约30%(对比传统2.54mm间距);
  • 安装方式:立贴式(SMD),兼容回流焊工艺,适配自动化贴装线,提升生产效率;
  • 尺寸精度:板上底边长度(间距线方向)为16mm±0.1mm,针脚高度、间距一致性高,便于PCB布局规划;
  • 插拔兼容性:插针采用标准化设计,与星坤配套线端连接器插拔顺畅,插拔力控制在1~3N(单Pin平均力≤0.5N),重复插拔≥50次无性能衰减。

四、材料与工艺特性

材料选型兼顾可靠性与环境适应性:

  • 塑料主体:采用PA9T(聚邻苯二甲酰胺) —— 热变形温度约270℃,适配回流焊峰值温度(260℃±5℃),无变形风险;阻燃等级达UL94V-0(无卤),遇火自熄,满足电子设备防火安全要求;
  • 触头结构:黄铜材质(导电率高),表面镀锡(Sn)厚度3~5μm,符合RoHS 2.0环保标准;
  • 工艺细节:针脚采用精密冲压成型+镀金(可选)工艺,确保尺寸精度与接触稳定性;塑料主体采用注塑成型,无飞边毛刺,适配自动化组装。

五.环境适应性参数

可满足多场景下的稳定运行:

  • 工作温度:-25℃~+85℃,覆盖大部分室内电子设备的环境范围,低温下无脆化现象,高温下无变形软化;
  • 耐候性:通过盐雾试验(5% NaCl,48h)、湿热试验(40℃/95%RH,96h),触头无腐蚀、塑料无开裂;
  • 振动冲击:符合IPC-TM-650标准,振动频率10~2000Hz下无接触中断,冲击加速度10g下性能稳定。

六、典型应用场景

因小间距与高可靠性特点,该针座广泛应用于以下领域:

  1. 消费电子:智能手机、平板电脑内部电池、摄像头模块的板端连接;
  2. 小型家电:智能音箱电源接口、路由器信号板连接、机顶盒内部传输;
  3. 工业控制:小型PLC输入输出接口模块板、传感器信号采集端;
  4. 汽车电子:车载USB充电器、倒车雷达控制器的辅助电源连接(满足汽车级环境要求)。

七、品牌与可靠性背书

XKB Connectivity(星坤)是国内连接器行业的资深厂商之一,X2011WVS系列产品:

  • 符合RoHS REACH环保标准,无铅无卤;
  • 通过UL CE认证,质量管控符合ISO9001/TS16949体系;
  • 星坤具备年产能超10亿件连接器的生产能力,并提供定制化服务(如Pin数调整、镀层优化等)。

综上,X2011WVS-06A-9TSN以小间距设计、高可靠性与自动化适配为核心优势,成为中小功率电子设备板端连接的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.