WMSIC Electronic Components

XKB Connectivity X0800WVS-04HF-LPV01 X0800WVS

ModelX0800WVS-04HF-LPV01
PackageSMD,P=0.8mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X0800WVS-04HF-LPV01
Type
XKB CONNECTIVITY
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X0800WVS-04HF-LPV01
Electronic Component
1
Package
SMD,P=0.8mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.093g
Electronic Component
0.8mm
PIN
4P
Electronic Component
1
Electronic Component
BM0265370495
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Pin
1x4P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X0800WVS-04HF-LPV01线对板连接器产品概述

X0800WVS-04HF-LPV01是XKB Connectivity(中国星坤)推出的一款小型化刺破式线对板连接器,针对高密度、低功耗电子设备的连接需求优化设计,具备立贴安装、小间距、环保无卤等核心特性,可适配多领域应用场景。

一、核心基础参数梳理

该连接器的基础规格可从结构、电气、材质、尺寸四个维度清晰呈现:

  • 结构规格:采用1排4Pin(1×4P)布局,引脚间距0.8mm(小间距设计);安装方式为立贴(垂直表面贴装),适配PCB表面贴装工艺;核心连接方式为刺破式针座,无需额外剥线即可实现导线与针座的电气连接。
  • 电气参数:额定电流500mA(AC/DC通用),额定电压30V,满足低功耗设备的功率传输需求;工作温度范围覆盖-25℃至+85℃,适应不同环境温度下的稳定运行。
  • 材质配置:触头基底为黄铜(兼具导电性与机械强度),表面镀层为锡(焊接性能优异、成本可控);塑料主体选用LCP(液晶聚合物),耐温性强,适配回流焊工艺;整体无卤设计,阻燃等级达UL94V-0。
  • 尺寸细节:X轴板上底边长度(间距线)5.38mm,整体尺寸紧凑;封装形式为SMD(表面贴装),适配自动化贴装设备。

二、关键特性与应用优势

产品核心特性直接对应实际应用中的价值:

  1. 刺破式设计简化装配:无需预先剥除导线绝缘层,针座触头可直接刺破绝缘层实现可靠连接,大幅减少工序、降低人工成本,同时避免导线剥线损伤风险。
  2. 小间距立贴节省空间:0.8mm引脚间距+立贴安装,可在有限PCB面积内实现高密度连接,适配智能手环、蓝牙耳机等小型化设备的内部布局。
  3. 环保与安全双重保障:无卤设计符合RoHS指令,可用于环保要求严格的产品;UL94V-0阻燃等级能有效抑制火焰蔓延,提升设备安全性能。
  4. 稳定可靠的电气性能:黄铜触头+锡镀层确保低接触电阻与良好焊接性,宽温范围(-25℃~+85℃)可在极端环境下保持连接稳定,减少故障概率。

三、典型应用场景

结合产品特性,该连接器广泛适用于以下场景:

  • 小型消费电子:智能手环、蓝牙耳机、便携音箱、智能手表等可穿戴设备与小型音频设备的内部连接;
  • 智能家居设备:智能开关、温湿度传感器、小型家电控制板(如智能插座、加湿器模块)的信号/低功率传输;
  • 工业控制领域:小型传感器节点(压力、位移传感器)、微型PLC控制器接口的连接;
  • 汽车电子辅助设备:车载小屏、车内氛围灯控制模块、胎压监测传感器模块的内部连接(需匹配具体车载温度需求)。

四、可靠性与合规性说明

产品在可靠性与合规性方面具备明确保障:

  • 环境适应性:宽温范围覆盖-25℃~+85℃,可适应室内外不同环境,满足多数电子设备使用需求;
  • 机械稳定性:LCP塑料主体强度高,立贴安装后可承受一定机械应力,减少连接松动风险;
  • 合规认证:UL94V-0阻燃、无卤设计符合国内外环保与安全标准(如RoHS);
  • 焊接可靠性:SMD封装+锡镀层触头适配回流焊工艺,不易出现虚焊/假焊,提升产品良率。

五、品牌与封装适配

X0800WVS-04HF-LPV01由XKB Connectivity(中国星坤)生产,该品牌在连接器领域具备丰富研发生产经验,产品质量稳定;SMD封装适配自动化贴装生产线,可实现高效批量生产,降低周期成本。

综上,该连接器以小间距、立贴、刺破式为核心优势,兼顾环保、安全与可靠性,是小型化电子设备内部连接的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.