Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XKB Connectivity TS-1102S-C-M-B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity TS-1102S-C-M-B
- Type
- XKB CONNECTIVITY
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- TS-1102S-C-M-B
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Electronic Component
- Electronic Component
- Switch
- Electronic Component
- 0.858g
- Electronic Component
- 2.6N
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0265857931
- Electronic Component
- Electronic Component
- Electronic Component
- 30
- Operating Temperature
- 20℃~+70℃
- Switch
- 6mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TS-1102S-C-M-B轻触开关产品概述
一、产品核心定位
TS-1102S-C-M-B是XKB Connectivity（中国星坤）推出的一款小型化贴片式轻触开关，主打“紧凑空间适配+操作手感平衡”的应用场景。该产品采用6×6×10mm标准尺寸，立贴式SMD封装，无支架设计，兼顾安装便捷性与电路控制可靠性，适用于消费电子、工控、通讯等多领域的轻载控制需求。
二、关键技术参数详解
TS-1102S-C-M-B的参数围绕“小型化+稳定控制”设计，核心参数如下：
- 电路结构：单刀单掷（SPST），通断逻辑简单，无多余触点干扰，适合单一功能键控制；
- 操作手感：作用力2.6N（对应260gf），介于轻触（1.5-2N）与中触（3-4N）之间，既避免口袋挤压等误触，又无需过大操作力，长期使用不易疲劳；
- 电气性能：触点电流额定50mA，额定电压12V，适配低功耗电路（如单片机、传感器模块），银合金触点降低接触电阻波动；
- 尺寸规格：长6mm×宽6mm×高10mm，属于轻触开关常规小型化尺寸，满足PCB高密度布局；
- 寿命与环境：工作寿命30万次，覆盖多数终端产品3-5年使用周期；工作温度-20℃~+70℃，适配室内常温、车载常温等场景。
三、结构与安装特性
该产品结构聚焦“安装效率+空间利用”：
- 封装与安装：SMD立贴封装，不带支架，可直接通过自动化贴片机焊接，无需额外固定，简化组装流程；立贴方式垂直于PCB，相比卧贴更节省水平空间；
- 按钮设计：圆形按钮+黑色盖帽，无灯设计，外观简洁统一，圆形触感明确，黑色盖帽耐脏且适配多数产品配色；
- 结构稳定性：内部一体化触点结构，避免松动，确保每次操作通断一致性。
四、典型应用场景
TS-1102S-C-M-B适配以下场景：
- 消费电子：小型家电（遥控器、加湿器功能键）、智能穿戴（手环/手表模式切换键）；
- 工控设备：小型PLC、温湿度传感器的参数设置键；
- 通讯设备：路由器、交换机的复位键；
- 车载周边：车载充电器、行车记录仪的电源开关；
- 医疗小型设备：便携式血糖仪、血压计的功能键。
五、可靠性与品质保障
作为XKB星坤常规产品，该开关具备可靠品质：
- 触点可靠性：银合金触点，接触电阻<50mΩ，避免信号丢失；
- 寿命验证：30万次循环操作测试，确保生命周期无失效；
- 环境测试：温湿度循环测试（-20℃+70℃，40%90%RH），验证温变稳定性；
- 品牌背书：XKB拥有ISO9001/14001认证，产品服务华为、小米等终端厂商。
六、产品优势总结
TS-1102S-C-M-B核心优势：
- 小型化适配：6×6×10mm尺寸，满足高密度PCB布局；
- 安装高效：SMD立贴无支架，自动化生产友好；
- 手感平衡：2.6N作用力，误触率低+操作舒适；
- 可靠稳定：30万次寿命+银合金触点，长期无故障；
- 性价比突出：无灯设计+简洁结构，成本可控，适合批量应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
