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XKB Connectivity X0802FVS-40AS-LPV01 X0802FVS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity X0802FVS-40AS-LPV01
- Type
- XKB CONNECTIVITY
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- X0802FVS-40AS-LPV01
- Electronic Component
- 1
- Package
- SMD,P=0.8mm
- Electronic Component
- 2
- Electronic Component
- and Connector
- Electronic Component
- 1.01g
- Electronic Component
- 0.8mm
- PIN
- 40P
- Electronic Component
- 1
- Electronic Component
- BM0264555472
- Electronic Component
- Electronic Component
- Operating Temperature
- 25℃~+85℃
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X0802FVS-40AS-LPV01 板对板连接器（母座）产品概述
一、产品核心定位与应用场景
X0802FVS-40AS-LPV01是中国星坤（XKB Connectivity）推出的高密度立贴式板对板（BTB）母座连接器，专为紧凑空间内的PCB板间信号/小功率供电连接设计，兼顾“高密度布局”“生产兼容性”与“环境可靠性”，广泛适配以下领域：
- 消费电子：智能手机、平板电脑、智能手表等可穿戴设备（主板与副板/模块的连接）；
- 智能家居：智能音箱、智能门锁、控制器（小体积模块间稳定连接）；
- 工业控制：小型PLC、传感器终端、物联网网关（宽温环境下的可靠传输）；
- 汽车电子：车载小模块（如导航辅助、音响控制，满足车内温湿度要求）。
二、基础参数与物理特性
该产品核心参数明确，适配主流电子设备的设计需求：
类别 具体参数 关键说明 引脚与布局 40Pin（2排）、0.8mm间距 平衡“高密度”与“加工难度”，适合紧凑PCB 安装与封装 立贴式（SMD）、表面贴装 兼容自动化SMT生产线，减少插件工序 结构设计 合高5.0mm、带定位柱 定位柱提升安装精度，避免PCB偏移；合高适配堆叠空间 材料构成 端子（AMP料）、绝缘料（LCP） LCP耐回流焊高温，AMP端子接触稳定 电气性能 额定电流500mA/Pin、工作温区-25℃~+85℃ 满足常规信号传输与小功率供电，覆盖工业/消费场景三、结构设计与可靠性优势
产品设计针对“高密度连接”的痛点优化，核心优势体现在：
- 定位柱防偏移：自带定位柱与PCB定位孔精准配合，避免SMT过程中连接器偏移，提升生产良率（降低虚焊/错位风险）；
- LCP绝缘料耐用性：液晶聚合物（LCP）绝缘主体耐260℃以上回流焊高温，尺寸稳定性强（长期使用无变形），适配高温老化环境；
- AMP端子接触可靠：端子采用AMP系列材料，抗氧化、插拔力均匀（无卡滞/过松），接触电阻低（<10mΩ），保障信号完整性；
- 立贴节省空间：垂直安装方式节省PCB水平布局空间，适配多层板或紧凑整机设计（如智能手表内部模块堆叠）。
四、选型与使用注意事项
为确保连接可靠性，需注意以下要点：
- 公座匹配：需搭配星坤同系列BTB公座（合高一致），避免配合间隙过大/过小导致连接不良；
- SMT工艺：回流焊温度曲线需适配LCP料特性（峰值温度≤260℃，时间≤10s），防止绝缘料变形；
- 存储要求：常温干燥环境存储（温度25℃±5℃、湿度40%~60%），避免端子氧化；
- 插拔次数：常规插拔次数≥500次，高频插拔场景需做防护（如加防尘盖）。
五、市场价值与替代优势
作为国产BTB连接器，X0802FVS-40AS-LPV01具备以下市场竞争力：
- 性价比：替代进口同类产品（如TE、JAE），成本降低20%~30%；
- 交期灵活：星坤国内产能充足，支持小批量定制与快速交付；
- 兼容性：适配主流电子设备的PCB设计规范，无需额外修改电路布局。
综上，该产品是紧凑空间内PCB板间连接的高性价比选择，兼顾性能、成本与生产效率，可满足中高端电子设备的高密度连接需求。
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