WMSIC Electronic Components

XKB Connectivity XKTF-015-G

ModelXKTF-015-G
PackageSMD
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity XKTF-015-G
Type
XKB CONNECTIVITY
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
XKTF-015-G
Electronic Component
1
Package
SMD
Electronic Component
SD / Connector
Electronic Component
0.913g
Type
Micro SD
Electronic Component
1
Electronic Component
BM0264935500
Operating Temperature
25℃~+90℃
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
Electronic Component
Electronic Component
1000
Electronic Component
2mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XKTF-015-G自弹式MicroSD卡座产品概述

XKTF-015-G是中国星坤(XKB Connectivity)推出的一款SMD封装自弹式MicroSD(TF)卡座,针对小型化、高可靠性存储扩展场景设计,兼顾便捷插拔与宽温适应性,广泛适配消费电子、工业控制、车载等多领域应用。

一、产品核心规格与定位

作为星坤TF卡座系列的典型型号,XKTF-015-G的核心参数清晰定义了其应用边界:

  • 卡连接方式:自弹式设计(无工具插拔,轻按即弹出);
  • 兼容卡型:MicroSD卡(TF卡,含标准/高速MicroSDHC/MicroSDXC);
  • 封装类型:表面贴装(SMD),适配自动化SMT生产线;
  • 本体尺寸:最大高度仅2mm,满足小型化设备的轻薄需求;
  • 工作温度范围:-25℃~+90℃,覆盖常规消费电子及工业级环境;
  • 环保标准:符合RoHS指令,无铅焊接兼容。

二、关键设计优势

XKTF-015-G的核心竞争力体现在便捷性、轻薄性与可靠性的平衡:

  1. 自弹式插拔体验:无需额外工具,卡插入后轻按即可弹出,降低用户操作门槛,尤其适合频繁插拔存储的场景(如记录仪、便携音箱);
  2. 超轻薄SMD封装:2mm本体高度+表面贴装设计,大幅节省PCB空间,适配智能手表、手环等紧凑设备的内部布局;
  3. 宽温环境适应性:-25℃至+90℃的工作温度,可稳定运行于户外(车载、安防)、工业现场(控制终端)等极端环境;
  4. 可靠接触性能:接触件采用高导电铜合金材质,表面镀金处理(常规厚度0.3μm以上),抗氧化能力强,插拔寿命可达5000次以上,减少接触不良风险;
  5. 抗振动冲击:结构设计符合IEC 60068-2-6振动测试标准,可承受10~2000Hz的振动频率,适配运输及动态使用场景(如车载记录仪)。

三、典型应用场景

XKTF-015-G的参数特性使其适配多类设备,核心应用场景包括:

  1. 智能穿戴设备:智能手表、手环、运动相机——轻薄设计匹配设备小型化,自弹插拔方便更换存储;
  2. 便携电子终端:蓝牙音箱、移动电源、便携式投影仪——扩展本地存储,满足音频、视频文件存储需求;
  3. 工业控制终端:PLC扩展模块、数据采集器——宽温性能适配车间高低温环境,可靠存储工业数据;
  4. 车载电子系统:行车记录仪、车载中控、倒车影像——抗振动+宽温,适应汽车内部温度变化及行驶振动;
  5. 智能家居设备:智能摄像头、网关、智能音箱——本地存储视频/日志,避免云端依赖。

四、安装与使用注意事项

为确保产品性能稳定,需注意以下安装细节:

  1. SMD焊接要求:适配回流焊工艺,焊接温度控制在260±5℃,单回流焊时间不超过10秒,避免热损伤接触件;
  2. PCB布局建议:焊盘设计需符合IPC-A-610标准,预留0.5mm以上间距,避免相邻元件干扰;
  3. 插拔操作规范:卡插入时需对准卡座槽口,轻按至听到“咔哒”声锁定;弹出时再次轻按,避免过度用力导致结构变形;
  4. 环境防护:避免在湿度超过95%的环境中长期使用,如需户外应用建议搭配防水外壳。

五、总结

XKTF-015-G作为星坤针对MicroSD存储扩展的主力型号,以自弹便捷性、轻薄SMD封装、宽温可靠性为核心,覆盖了消费电子到工业级的多场景需求。其高性价比与稳定性能,使其成为小型化设备存储扩展的优选方案,适配从智能穿戴到车载工业的多元化应用。

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