WMSIC Electronic Components

XKB Connectivity X10B25L11T

ModelX10B25L11T
PackageSMD, P=1mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X10B25L11T
Type
XKB CONNECTIVITY
Minimum package
2000

Technical parameters

Electronic Component
XKB CONNECTIVITY
Electronic Component
X10B25L11T
Electronic Component
1
Package
SMD, P=1mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.613g
Electronic Component
1mm
Electronic Component
1
Electronic Component
BM0230063789
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃
Electronic Component
2.5mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
11P
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X10B25L11T — FPC连接器(1.0mm 抽拉式,H=2.5mm,11P,下接)

一、产品概述

X10B25L11T 为中国星坤(XKB Connectivity)推出的一款低高度抽拉式FPC连接器,间距1.0mm,触点数11P,采用下接(Bottom Entry)接入方式并卧贴安装,适配厚度0.3mm的柔性扁平电缆。整体板上高度仅2.5mm,面向对空间与厚度有严格限制的便携与嵌入式产品设计场景。

二、主要参数

  • 锁定特性:抽屉式(抽拉/滑动插入力设计)
  • 触点类型:下接(从板下方向插入FPC)
  • 触点数量:11P
  • 间距:1.0mm(P=1mm)
  • 安装方式:卧贴(水平贴装,低外形)
  • 适配FPC厚度:0.3mm
  • 板上高度:2.5mm
  • 触头材质:磷青铜
  • 触头镀层:锡(Sn)
  • 工作温度:-40℃ ~ +85℃
  • 封装形式:SMD,适合自动贴装与回流工艺

三、结构与材料特点

触头采用磷青铜材质,保证弹性与导电性;表面锡镀层利于焊接及导通性,兼容常规焊接与组装流程。抽屉式锁定设计便于FPC多次插拔与装配维护,同时下接结构使得FPC布线更为整洁,降低对上方空间的占用。

四、电气与可靠性

在-40℃到+85℃的工作温度范围内稳定工作,适合工业级与消费电子环境。锡镀触点在信号传输与低电流应用中具有良好接触可靠性;抽拉式机构在规范操作下能满足多次插拔需求(具体寿命请参照供货方测试报告)。

五、PCB与装配建议

  • 采用SMD贴装,推荐基于厂家提供的焊盘尺寸与布局设计PCB;
  • 贴装后建议采用回流焊工艺,遵循锡铅或无铅回流曲线要求;
  • 预留足够的取放与测试空间,避免焊接后在插拔时对周边元件产生机械干涉;
  • FPC插入时注意方向与锁定定位,避免反向插入或超行程用力。

六、典型应用

适用于移动终端、车载显示模组、小型摄像头、仪器仪表、工业控制板、消费类电子及任何要求低厚度卧贴FPC连接的场合。

七、订购与包装

型号:X10B25L11T,品牌:中国星坤(XKB Connectivity)。封装形式:SMD,单位包装与出货信息请咨询供应商或经销商,索取产品尺寸图与回流焊曲线以确保设计与工艺匹配。

备注:以上为基于产品基础参数的概述。对于电气寿命、最大电流、插拔次数等详细可靠性指标,请向厂家索取完整规格书与测试报告以用于最终设计验证。

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