WMSIC Electronic Components

XKB Connectivity TS-1101NH-C-B-B

ModelTS-1101NH-C-B-B
PackageSMD
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity TS-1101NH-C-B-B
Type
SMD
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
TS-1101NH-C-B-B
Electronic Component
1
Package
SMD
Electronic Component
Electronic Component
Electronic Component
Switch
Electronic Component
0.308g
Electronic Component
2.6N
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264965679
Electronic Component
Electronic Component
Electronic Component
5
Operating Temperature
20℃~+70℃
Switch
3.5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS-1101NH-C-B-B 产品概述

一、产品概述

TS-1101NH-C-B-B 是 XKB Connectivity(中国星坤)推出的一款小尺寸立贴式轻触开关,外形紧凑、手感稳定,适用于空间受限的贴片电路板。开关为单刀单掷(SPST)结构,矩形黑色按键,工作寿命高,可满足一般消费类与工业类低电流信号控制需求。

二、主要技术参数

  • 电路结构:单刀单掷(单路常开/常闭视具体型号)
  • 按钮形状:矩形按钮(黑色)
  • 操作力:2.6N(约260gf)
  • 尺寸:长 6.0 mm × 宽 3.5 mm × 高 5.0 mm(立贴)
  • 封装:SMD(立贴)/ 不带支架
  • 触点电流:50 mA
  • 额定电压:12 V DC
  • 带灯:无
  • 工作寿命:50,000 次(标准寿命)
  • 工作温度:-20 ℃ ~ +70 ℃

三、结构与封装特点

该产品为立贴(垂直安装)SMD 结构,占板面积小、厚度低,便于高密度布板和自动化贴装。开关本体无外置支架,焊脚为板面焊接形式,适配现代回流焊生产线(具体回流温度曲线请参照厂家资料)。矩形按键提供明确的触感定位,适合需要清晰按压回馈的场合。

四、性能与可靠性

TS-1101NH-C-B-B 设计用于低电流信号切换,触点电流上限为 50 mA,额定工作电压 12 V,适合键盘矩阵、微控制器输入等应用。标称寿命 5 万次,适度的环境温度范围(-20~+70 ℃)保证了在常见消费电子和轻工业环境中的可靠性。为获得一致性能,建议在装配后进行焊接质量与接触电阻的抽检。

五、典型应用场景

  • 便携式电子设备按键(遥控器、小家电)
  • 工业仪表、控制面板的功能键
  • 小型电子模块、人机界面输入按键
  • 各类低电流逻辑信号开关场合

六、选型与使用建议

  • 载流能力与电压:仅用于低电流、低压信号线路;如需直流大电流或交流电源切换,请选择额定更高的开关。
  • 焊接与贴装:本为 SMD 立贴件,推荐使用厂家提供的焊盘尺寸和回流曲线,回流后建议检查焊点质量与机械牢固度。
  • 机械应力:因无支架,线路板回流或装配后避免对按键产生直接弯曲或冲击,必要时考虑粘接或加固固定。
  • 环境与清洁:工作温度在厂家标称范围内;若有清洗工序,请确认清洗剂和工艺不会侵入开关缝隙影响触点。
  • 质量验证:建议在产品开发阶段进行寿命测试、操作力测试和接触电阻测试,批量使用前进行抽样检验。

本产品以小巧、手感稳定和成本效益著称,适合对体积和贴装兼容性有要求的低功耗信号控制场合。更多详细安装图纸、回流工艺和可靠性数据,请联系 XKB Connectivity(中国星坤)获取完整数据表。

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