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XKB Connectivity TS-1109TP-C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity TS-1109TP-C
- Type
- XKB CONNECTIVITY
- Minimum package
- 750 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- TS-1109TP-C
- Electronic Component
- 1
- Package
- SMD,4.5x4.5mm
- Electronic Component
- Electronic Component
- Electronic Component
- Switch
- Electronic Component
- 0.661g
- Electronic Component
- 2.6N
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0265307785
- Electronic Component
- 10
- Operating Temperature
- 30℃~+85℃
- Switch
- 4.5mm
- Switch
- 4.5mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TS-1109TP-C 产品概述
一、产品简介
TS-1109TP-C 是 XKB Connectivity（中国星坤）推出的一款低电流轻触按键，采用单刀单掷（SPST）结构，圆形按钮设计，适用于对体积、手感和可靠性有较高要求的小型电子设备。该型号为贴片带支架结构，便于表面贴装工艺和波峰/回流焊接工序的组合应用。
二、主要参数
- 操作力：2.6 N（约 260 gf），触感明确、回弹良好。
- 外形尺寸：开关基座 4.5 × 4.5 mm，整体高度约 3.85 mm，属于低矮型微型开关。
- 触点电流：50 mA；额定电压：12 V DC，适合低压低流应用。
- 按钮颜色：黑色；带灯：否。
- 工作寿命：100,000 次；工作温度范围：-30 ℃ 至 +85 ℃。
三、结构与外形特点
TS-1109TP-C 采用圆形按帽与紧凑基座设计，开关体积小、占板面积低。贴片支架形式提高了安装强度和可靠性，便于自动化贴装。结构适配常见 PCB 布局，按键回位迅速、行程稳定，适合需要明确触觉反馈的按键场景。
四、使用与安装建议
- 推荐采用常规 SMT 工艺进行贴装，支架设计有利于回流焊固定；回流工艺时应避免超过元件允许的温度极限以保护塑料件。
- 产品为低电流触点，建议在实际应用中考虑接触材料和清洁度，避免长期低电流下的接触氧化现象。
- 装配时注意按键方向与 PCB 开孔、周边元件间距，保证按键行程不受阻碍。
- 如需批量供货或特殊包装（卷带、托盘等），可与供应方协商定制。
五、典型应用场景
适用于遥控器、小型家电控制面板、手持仪器、便携医疗设备、消费电子开关键位、物联网终端及工业控制面板等需要紧凑空间与可靠按键反馈的场合。
六、可靠性与维护
凭借 10 万 次的工作寿命与宽温工作范围，TS-1109TP-C 在常规使用场景下具有良好的耐久性。对长期稳定性有更高要求的应用，可在设计时增加防护措施（如防尘罩或密封处理）。为保证产品性能，建议在存储与装配过程中注意防潮、防污染，并遵循良好的焊接工艺规范。
如需更详细的 PCB 封装图、力行程曲线或环境试验报告，请联系 XKB Connectivity 或授权分销商获取技术资料与样品支持。
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