WMSIC Electronic Components

Xinglight XL-IRM1738C

ModelXL-IRM1738C
PackageSMD-3P,6.8x5.3mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-IRM1738C
Type
XINGLIGHT
Minimum package
1000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-IRM1738C
Electronic Component
1
Package
SMD-3P,6.8x5.3mm
Electronic Component
Receiver (IRM)
Electronic Component
0.639g
Electronic Component
1
Frequency
37.9kHz
Electronic Component
BM0259344685
Operating Temperature
40℃~85℃
Operating Voltage
2.7V~5.5V
Operating Current
300uA
Receiver
12m
Power Dissipation(Pd)
250mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-IRM1738C 红外遥控接收头产品概述

一、产品简介

XL-IRM1738C 是成兴光(Xinglight)推出的一款表面贴装红外遥控接收头(SMD-3P,尺寸 6.8 × 5.3 mm),工作电压范围宽(2.7V ~ 5.5V),工作电流低(典型 300 µA),能够接收中心载波频率约 37.9 kHz 的调制红外信号并输出已解调的数字码。器件适用于电视、机顶盒、空调、音响、家用电器及各类需要红外遥控的终端设备,接收距离可达约 12 m,工作温度范围宽(-40 ℃ ~ 85 ℃),可靠性高且易于在自动贴装生产线上使用。

二、主要规格亮点

  • 工作电压:2.7V ~ 5.5V,兼容常见单片机与系统供电电压。
  • 工作电流:典型 300 µA,适合低功耗设计。
  • 中心频率:37.9 kHz(设计用于常见 38 kHz 带载波遥控码)。
  • 可接收距离:约 12 m(视发射端功率、角度与环境光干扰而定)。
  • 耗散功率(Pd):250 mW,注意器件功耗在较高环境温度下的限制。
  • 工作温度:-40 ℃ ~ 85 ℃,适应室内与部分工业环境。
  • 封装:SMD-3P,外形尺寸 6.8 × 5.3 mm,适合表面贴装工艺。

三、功能与性能特点

  • 解调输出:器件内置前端光电接收与解调电路,直接输出已解调的数字遥控码(便于 MCU 读取与译码)。
  • 对常见编码兼容:对 NEC、RC5、SONY 等基于 38 kHz 左右载波的常见遥控协议具有良好兼容性。
  • 高信噪比:对背景光(含荧光灯、日光)具有抑制能力,提高误触发门限。
  • 封装小巧:SMD-3P 便于高密度 PCB 布局与自动化贴装,降低组装成本。
  • 低功耗:典型电流 300 µA,适合待机功耗敏感的消费电子设备。

四、典型引脚功能(参考)

  • VCC:电源正极,供电范围 2.7V~5.5V。
  • GND:电源负极/地。
  • OUT:解调后的数字输出(常见为主动低电平输出,与上拉电阻搭配使用以接入 MCU)。
    (注:具体引脚排列请参照厂商出具的引脚图与封装示意图以保证接线正确。)

五、典型应用连接建议

  • 电源去耦:在 VCC 与 GND 之间并联 0.01 µF ~ 0.1 µF 陶瓷电容以抑制电源干扰,靠近引脚布局。
  • 上拉电阻:若输出为开漏或主动低电平输出,推荐在 OUT 与 VCC 之间并联 10 kΩ 上拉电阻(根据系统输入要求可适当调整)。
  • PCB 布局:避免在接收头前方放置高反射或强干扰元件;尽量保证接收窗口无遮挡并朝向红外发射端。
  • 避免直射强光源:将器件远离太阳直射或强红外发射源以减少误触发或灵敏度下降。
  • 取样接口:MCU 程序上需配置外部中断或定时采样以识别遥控编码的脉宽与时序。

六、封装与制造、可靠性建议

  • 封装:SMD-3P,外形尺寸 6.8 × 5.3 mm,适合回流焊工艺。请参照产品尺寸图完成 PCB land pattern 设计。
  • 回流焊:按供应商提供的回流曲线进行焊接,避免超规高温或长时间保温。
  • ESD 与静电防护:该类光电器件对静电较敏感,生产、运输与装配过程中应采取静电防护措施。
  • 贮存与搬运:避免长期在高温高湿环境下保存,未使用封装请密封保存以防潮湿。

结语 XL-IRM1738C 以其低功耗、兼容常见遥控载波、SMD 小封装等优点,适合用于各类要求稳定远距离红外遥控接收的消费与工业产品。在设计中结合合适的电源去耦、PCB 布局与软件解码策略,可快速集成并获得稳定的遥控接收性能。若需详细引脚图、封装尺寸图或典型电路图,请联系成兴光或查看该型号的原厂数据手册以获得精确资料。

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