WMSIC Electronic Components

Silergy SY8705BFCC

ModelSY8705BFCC
PackageSOIC-8-EP
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY8705BFCC
Type
SILERGY
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8705BFCC
Electronic Component
1
Package
SOIC-8-EP
Electronic Component
LEDDriver
Electronic Component
PWM; Analog
Electronic Component
0.25g
Electronic Component
1
Channel Count
1
Features
(OTP)
Electronic Component
BM0230006834
Operating Temperature
40℃~+125℃
Switching Frequency
800kHz~1.2MHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY8705BFCC 产品概述

一、产品简介

SY8705BFCC 是矽力杰(silergy)推出的一款高效率、1MHz 级开关频率的降压型白光 LED 驱动器。器件集成开关管,单通道输出,能够为串联白光 LED 提供最高 3A 的恒流驱动,支持宽输入电压范围并具备 PWM 与模拟调光能力,适用于消费、照明及车载背光等场合。

二、主要参数

  • 工作电压(DC):2.5V ~ 30V
  • 开关频率:800kHz ~ 1.2MHz(典型 1MHz)
  • 通道数:1
  • 输出电流:3A(恒流能力)
  • 调光方式:PWM 调光 / 模拟调光
  • 拓扑结构:降压(Buck)
  • 开关管:内部集成
  • 工作温度:-40℃ ~ +125℃
  • 保护特性:过温保护(OTP)
  • 封装:SOIC-8-EP(带散热焊盘)

三、功能特性

  • 高效率降压设计,适合较大电流输出场合,减少系统发热与功耗。
  • 宽输入电压支持多种电源方案,兼容从单节锂电池到车载电源的应用。
  • 支持 PWM 与模拟两种调光方式,PWM 频率兼容常见亮度控制要求,模拟调光可实现平滑亮度变化。
  • 内置开关管、简化外部器件选型与 PCB 布局,降低整体 BOM 成本与体积。
  • 内置过温保护,提高系统可靠性;建议在系统设计时参照 Datasheet 做完整保护联动。

四、典型应用场景

  • 手机、平板与笔记本背光驱动
  • 室内/商业照明与泛光灯驱动
  • 汽车仪表、车内氛围灯(符合宽温设计)
  • 标牌与广告灯箱

五、设计要点与推荐外部器件

  • 电感:建议选用低 DCR、饱和电流大于 3A 的功率电感(常见选型 1µH ~ 4.7µH,依据电流纹波与效率权衡)。
  • 输入/输出电容:使用低 ESR 陶瓷电容(X5R/X7R)做主滤波,输入侧并配合足够容值的旁路电容以抑制瞬态。
  • 布局:开关节点走线尽量短且集中,输入大电流回路(电源、开关管、地)形成紧凑环路;SOIC-8-EP 的散热焊盘必须焊接至 PCB 大面积铜箔并配合过孔引出至内部层提高热阻散热性能。
  • 调光接口:PWM 调光建议使用高/低电平清晰的 TTL 信号,频率避免与开关频率产生干涉(常取几百 Hz ~ 数十 kHz);模拟调光输入须参考器件内部阈值并加稳压/滤波电路。

六、封装与热管理

SOIC-8-EP 封装带大底电镀散热焊盘,利于把芯片产生的热量传导到 PCB。针对长期 3A 输出工作,应在 PCB 设计时增加铜面积、过孔并保持良好空气对流,必要时配合散热片或导热胶提升散热能力,确保器件工作在安全温度范围内以避免触发 OTP。

七、保护与可靠性

器件内置过温保护(OTP),在异常温升时自动限制或关闭输出以保护芯片。实际系统需在硬件与软件层面配合实现输入过压、欠压、短路等保护,并按照 Datasheet 给出的限制条件选型外部器件与调整工作点,以保证长期稳定可靠运行。

如需基于 SY8705BFCC 的参考电路、典型效率曲线或详细引脚说明,请参照厂商 Datasheet 或联系矽力杰技术支持获取完整设计资料。

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