WMSIC Electronic Components

Silergy SY8883DFC

ModelSY8883DFC
PackageWDFN-8-EP(2x2)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY8883DFC
Type
SILERGY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8883DFC
Electronic Component
1
Package
WDFN-8-EP(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.018g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0228147476
Operating Temperature
40℃~+85℃@(TA);-40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY8883DFC 产品概述

一、概述

SY8883DFC 是矽力杰(silergy)推出的一款降压型同步整流 DC-DC 转换器,面向对效率、体积和电流能力有较高要求的便携与嵌入式电源设计。器件输入电压范围宽(2.5V~5.5V),内部集成功率开关,采用降压拓扑并支持可调输出,开关频率高达 1MHz,最大输出电流 3A,适合在空间受限且需要低噪声、高效率的系统中作为主力稳压源。

二、主要规格亮点

  • 功能类型:降压型(Buck)
  • 输入电压:2.5V ~ 5.5V
  • 输出电流:最高 3A
  • 开关频率:1MHz
  • 同步整流:是(内置同步开关,提高转换效率)
  • 静态电流(Iq):55μA(低静态功耗,适合电池供电)
  • 输出类型:可调输出
  • 开关管:内置
  • 工作温度:-40℃~+85℃(TA),-40℃~+125℃(TJ)
  • 封装:WDFN-8-EP (2×2)

以上参数使 SY8883DFC 在功耗敏感与空间受限的移动/嵌入式应用中具有明显优势。

三、典型应用场景

  • 便携式与电池供电设备(手持终端、可穿戴设备、移动传感器)
  • IoT 节点与无线通信模块的主电源或从电源
  • 摄像头模组、DSP/MCU 供电
  • 模拟前端与数字电路低压供给(需可调输出的场合)
  • 嵌入式系统与工控小型模块

四、设计建议与注意事项

  • 输出电压设置:通过外部电阻分压实现可调输出,选择高精度、低温漂电阻以保证稳压精度。
  • 电感与电容选型:由于工作频率为 1MHz,一般优先选择低 DCR、适配高频性能的功率电感与低 ESR 的陶瓷电容(注意陶瓷电容 DC Bias 导致的有效电容下降)。
  • 布局要点:VIN、GND 到输入电容、开关节点之间走短回流路径;将功率回路(开关管、二极管/同步开关、功率电感、输入/输出电容)靠近芯片布置以减少 EMI 和压降。热垫(EP)必须焊接至 PCB 地,扩大散热面积。
  • 热管理:WDFN-8-EP 封装需要良好散热设计,适当增大底层散热铜箔并通过多层过孔将热量导出,防止长时间高负载下芯片温度超限。
  • 启动与瞬态性能:高效率同步整流器在大电流突变时容易产生瞬态偏差,需根据系统负载特性调整补偿网络与输出滤波,以满足稳态与瞬态响应要求。
  • 保护与可靠性:器件通常具备多种保护(如过流、过温等),但具体参数与行为应以原厂数据手册为准,设计中应预留软启动、限制峰值电流的外部保护机制以提高系统可靠性。

五、封装与可制造性

SY8883DFC 提供 WDFN-8-EP (2×2) 小尺寸封装,适合高密度布局。封装带有暴露热焊盘(EP),便于散热与可靠焊接。建议在 PCB 设计阶段就考虑回流工艺、热垫焊盘大小与过孔分布,以保证良好的一致性与热性能。

六、总结

SY8883DFC 以高开关频率、内部功率开关、同步整流与低静态电流的组合,为 2.5V~5.5V 输入、需 3A 输出的应用提供了高效率、体积小、适合电池供电的解决方案。在实际设计中,合理选择外部电感、电容与 PCB 热/走线布局,是发挥该芯片性能、保证稳定与可靠运行的关键。更多保护参数、典型应用电路与设计细节,建议参照矽力杰官方数据手册与参考布局指南。

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