WMSIC Electronic Components

Silergy SY6885BQDC

ModelSY6885BQDC
PackageQFN-16(3x3)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY6885BQDC
Type
SILERGY
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY6885BQDC
Electronic Component
1
Package
QFN-16(3x3)
Electronic Component
Power Electronic Switch
Electronic Component
0.133g
Electronic Component
1
Features
Output
Electronic Component
BM0227537451
Resistor
40mΩ
Operating Temperature
40℃~+125℃
Operating Voltage
4V~48V
Electronic Component
Electronic Component
Electronic Component
5000
Logic
Level

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY6885BQDC 产品概述

一、简介

SY6885BQDC 是硅力杰(silergy)推出的一款高性能电源负载开关,适用于宽电压范围系统的电源管理场景。器件支持 4V 至 48V 的工作电压,输入控制逻辑为“高电平有效”,集成软启动、输出放电及多重保护功能,提供可靠的上电管理与故障自保护能力,适合汽车电子、工业控制、通信设备与电源分配等应用。

二、主要特性

  • 工作电压:4V ~ 48V,覆盖汽车与工业常见母线电压等级。
  • 导通电阻:典型 40 mΩ,导通损耗低,适合较大电流传输。
  • 控制逻辑:输入端高电平有效,易于与 MCU、PMIC 等数字控制器直接驱动。
  • 软启动:内置上电限流功能,有效抑制电容性负载的冲击电流,避免系统复位。
  • 输出放电:禁用时对输出进行下拉放电,保证快速释放下游电容,便于电源重置与安全隔离。
  • 保护功能:具备过压保护(OVP)、过流保护(OCP)、过温保护(OTP)、欠压锁定(UVL),增强系统可靠性。
  • 工作温度:-40°C ~ +125°C,适应严苛环境应用。
  • 封装:QFN-16 (3x3),小体积、利于高密度电路板设计。

三、功能优势与应用场景

  • 降低热耗:40 mΩ 的低导通电阻显著降低导通功耗,使得在较高负载电流下仍可保持较低发热,有利于散热设计和系统可靠性。
  • 可控上电/复位:软启动与输出放电组合,可实现平滑上电与明确的关断状态,适用于电源序列管理与模块化电源控制。
  • 多重保护:内置 OVP/OCP/OTP/UVL 可在异常工况下自动保护系统,减少外部保护电路需求,缩短开发周期。
  • 应用示例:汽车车载电源、工业控制模块、电信/网络设备、电源管理单元、便携设备的电源路径控制等。

四、设计与注意事项

  • 电源旁路:建议在器件输入端与输出端各放置低 ESR 电解或陶瓷去耦电容,且尽量靠近器件引脚布置,以抑制瞬态变化与优化稳定性。
  • 散热考虑:在高电流条件下,按 P = I^2·RDS(on) 估算功耗并结合 PCB 铜箔与过孔进行热扩散;必要时使用散热铜箔或增加散热通道。
  • 控制信号:确保驱动端电平满足器件的逻辑阈值并避免在边缘条件下频繁翻转,以免触发误动作。
  • 布局建议:QFN-16 (3x3) 封装应配合底部焊盘和多片过孔布局,以提高热导和电流承载能力,减小寄生阻抗。

五、包装与可靠性

  • 封装形式:QFN-16 (3x3),适合表面贴装自动化生产。
  • 温度与可靠性:器件支持 -40°C 至 +125°C 工作温度,满足汽车级与工业级环境要求,配合合理的热设计可保证长期稳定工作。

综上所述,SY6885BQDC 以其宽电压范围、低导通损耗与完善的保护与控制功能,为需要可靠电源路径管理的系统提供了紧凑且高效的解决方案。若需更详细的电气参数、引脚定义和典型应用电路,请参考硅力杰官方数据手册。

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