WMSIC Electronic Components

Silergy SM8082EAAC

ModelSM8082EAAC
PackageSOT23-5
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SM8082EAAC
Type
SILERGY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SM8082EAAC
Electronic Component
1
Package
SOT23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.437g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265639890
Operating Temperature
40℃~+125℃
Operating Voltage
2.5V~5.5V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SM8082EAAC 产品概述

一、关键规格概述

SM8082EAAC 是矽力杰(silergy)推出的一款降压型(Buck)DC-DC 开关稳压器,面向空间受限且对效率、静态电流有较高要求的便携与嵌入式系统。主要参数如下:

  • 输出类型:固定输出(出厂有多种固定电压版本,选型时请确认目标输出电压)
  • 拓扑结构:降压式(Buck)
  • 同步整流:支持(集成同步开关,提高整流效率)
  • 开关晶体管:内置
  • 输入工作电压:2.5 V ~ 5.5 V
  • 最大输出电流:2 A
  • 开关频率:1.5 MHz(高频,有利于缩小外部元件体积)
  • 静态工作电流(Iq):约 100 µA(低静耗,适合电池供电场合)
  • 输出通道数:单通道
  • 工作温度:-40 ℃ ~ +125 ℃
  • 封装:SOT-23-5(小型、常用封装,便于手板与量产)

二、主要功能与优势

  • 高频开关(1.5 MHz):可使用小体积电感与陶瓷电容,整体方案占板面积小,适用于体积敏感的移动终端与便携设备。
  • 同步整流设计:降低整流损耗,在中高负载下能获得较高转换效率,延长电池续航。
  • 低静态电流(100 µA):空载或待机功耗低,有利于延长电池寿命,适合 IoT、可穿戴设备与低功耗控制器供电。
  • 内置开关管与单芯片方案:简化设计、减少外部元件数量,加快开发周期。
  • 宽工作温度范围:工业级温区,适用于工业与车载边缘类应用(需验证系统温升条件)。

三、典型应用场景

  • 锂电池或两节/三节电池供电的便携式设备(如便携式仪表、消费类电子)。
  • MCU / SoC 的主供电或外设供电(3.3V、1.8V 等固定电压版本)。
  • 穿戴设备、无线终端、IoT 节点。
  • 工业控制模块、通信设备的本地稳压电源(注意热管理)。

四、外部元件与选型建议

为保证稳定与效率,外部元件建议如下(为典型参考,具体需按目标输出电压与效率/纹波要求微调):

  • 输入电容:建议使用 4.7 µF ~ 10 µF 的陶瓷电容(X5R/X7R),耐压需覆盖最大输入电压并留裕量。
  • 输出电容:建议 22 µF ~ 47 µF 陶瓷电容,低 ESR 有助于降低输出纹波并提高瞬态响应。
  • 电感:选型需满足饱和电流 > 最大输出电流且 DCR 较低,典型范围 1.0 µH ~ 4.7 µH(依据输出电压与纹波要求选择),纹波电流建议控制在 Iout 的 20%~40%。
  • 布线与布局:输入电容应靠近 VIN 和 GND 引脚放置;开关节点(SW)走线应短且远离敏感模拟信号。
  • 保护与滤波:如存在发射/抗扰或过压风险,可在输入端加入 TVS、滤波器或额外的阻抗网络。

五、封装与热管理

SOT23-5 小型封装有助于节省 PCB 面积,但散热能力有限。高负载(接近 2 A)或高输入电压差时,应注意:

  • 保证良好 PCB 散热措施:增加铜箔面积并在地平面做过孔导热。
  • 在布局阶段避免将芯片置于高温器件旁,评估实际温升并留有热裕量。
  • 在持续大电流场景下做热仿真/实测,必要时限制持续输出功率或采用更大封装方案。

六、使用注意事项与布局建议

  • 以最短路径布置 VIN-输入电容 和 SW-电感-输出电容 回路,减少环路面积以降低 EMI。
  • 输出为固定电压版本,选择时确认目标电压与型号后缀一致;若需调节输出,请选用可调版本或替代器件。
  • 启用(EN)/软启动:若器件带有 EN/SD 引脚(通用设计),应确保上电顺序与控制逻辑满足系统要求。
  • 在调试阶段关注启动行为、负载瞬态与稳定性,必要时调整输出电容或加装阻尼网络以改善环路稳定性。

七、典型电路参考与调试建议

  • 典型电源模块为:VIN → 输入电容 → SM8082EAAC(VIN) → SW → 电感 → 输出电容 → 负载;同步 MOSFET 已内置,反馈由固定版本内部设定。
  • 调试时关注纹波、负载/无载效率与热性能,建议在目标应用板上做完整电磁兼容(EMC)与热测试。

八、结论

SM8082EAAC 以其高开关频率、同步整流与低静态电流的组合,适合对体积、效率和待机功耗有较高要求的便携与嵌入式系统。选型时请确认具体固定输出电压版本,并按推荐的外部元件与布局准则进行设计与验证,以确保系统稳定、可靠运行。若需获得针对具体输出电压(如 3.3V、1.8V 等)的参考电路或完整数据手册,可进一步查询矽力杰官方资料或提供目标电压与应用场景以便给出更具体建议。

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