WMSIC Electronic Components

Silergy SY8308RBC

ModelSY8308RBC
PackageQFN-20
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY8308RBC
Type
SILERGY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8308RBC
Electronic Component
1
Package
QFN-20
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.088g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0000744495
Operating Temperature
40℃~+125℃
Operating Voltage
4V~40V
Switching Frequency
350kHz;500kHz
Electronic Component
Electronic Component
Output Current
8A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY8308RBC 产品概述

SY8308RBC 是矽力杰(Silergy)推出的一款高效率、可调输出的同步降压稳压器,单通道输出,内置开关管,能够在宽输入电压范围内稳定提供高达 8A 的输出电流。器件采用 QFN-20 封装,适合空间受限但需高功率密度的应用场景。其典型描述为 “High Efficiency, 8.0A 40V Input Synchronous Step Down”。

一、主要规格亮点

  • 输入电压范围:4V ~ 40V,适应 12V/24V/36V 等多种系统电压。
  • 输出类型:可调输出,方便通过外部电阻设置目标电压。
  • 拓扑结构:同步降压(Buck),内置高边/低边开关管,减少外部组件。
  • 最大输出电流:8A,适合中大功率负载。
  • 静态电流(Iq):约 60μA,有利于低功耗/待机应用。
  • 开关频率:支持 350kHz 与 500kHz 两档,设计灵活以权衡效率与器件体积。
  • 封装:QFN-20,有利于散热与 PCB 布局。

二、性能与优势

  • 高效率:同步整流结构在中高负载下能显著减少导通损耗,提升系统总体效率。
  • 宽输入容限:4–40V 的输入范围使器件适合多种工业、电信及宽电压平台,具备良好的适配性。
  • 低静态电流:60μA 的静态电流在轻载或待机模式下能降低系统静态功耗,延长电源待机时间。
  • 可切换的开关频率:350kHz 可降低开关损耗、提高效率;500kHz 可使用更小的电感与电容,减小总体方案体积。

三、典型应用场景

  • 工业控制与自动化设备电源
  • 网络通信、基站与路由设备的局部供电
  • 车载电子(需注意车规认证需求)
  • 嵌入式系统与便携式设备的主降压或点位电源

四、设计注意事项(建议)

  • 电感选型:选择饱和电流 > 输出电流的电感(建议 >8A 余量),低 DCR 有助于提高效率。
  • 输出电容:采用低 ESR 的固态或陶瓷电容以降低纹波并提高瞬态响应。
  • 输入去耦:在 VIN 与 GND 端口靠近芯片放置足够的去耦电容,抑制输入尖峰与振铃。
  • PCB 布局:QFN-20 封装需良好散热,建议为热垫开铜且多层过孔接地,电流回流路径要短且宽。
  • 开关频率选择:根据成本与体积权衡,频率高可减小外部元件体积,但会增加开关损耗与 EMI。
  • 热管理:高负载下注意芯片结温,必要时增加铜厚或散热片。

五、封装与评价

QFN-20 封装在保证功率密度的同时便于散热处理,适合自动化 SMT 生产。总体来看,SY8308RBC 以其宽输入范围、高输出电流、低待机功耗和可选开关频率,为需要高效稳压且空间受限的系统提供了实用的降压解决方案。

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