WMSIC Electronic Components

Silergy SY81012VDC

ModelSY81012VDC
PackageQFN-19(3x4)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
silergy SY81012VDC
Type
SILERGY
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY81012VDC
Electronic Component
1
Package
QFN-19(3x4)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.111g
Electronic Component
1
Features
Output Voltage Sampling; Built-in LDORegulator;;; Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0263467532
Operating Temperature
40℃~+125℃
Operating Voltage
2.7V~16V
Switching Frequency
600kHz~1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SY81012VDC - 产品概述

一、产品简介

SY81012VDC 是矽力杰(silergy)推出的一款高集成度降压型开关稳压器,采用同步整流、内置开关管的降压拓扑,面向中高电流点对点电源应用。器件工作电压范围宽,支持可调输出,适合为处理器、电源管理模块及外设提供稳固的低压轨电源。

二、主要规格

  • 输出类型:可调(Vout 可在 0.6V~5.5V 范围内设定)
  • 输入电压:2.7V ~ 16V
  • 输出电流:最高 12A
  • 开关频率:600kHz ~ 1MHz(可选/典型)
  • 静态电流 Iq:850µA(轻载待机性能优秀)
  • 同步整流:是(内置同步开关)
  • 拓扑结构:降压式(Buck)
  • 工作温度:-40℃ ~ +125℃
  • 输出通道数:1 路
  • 封装:QFN-19(3×4)

三、关键特点

  • 高集成度:内置功率开关,降低外部元件数量和布局复杂度。
  • 宽输入、可调输出:适应多种电池和总线电压,输出电压范围覆盖多数点电压需求。
  • 低静态电流:850µA 的静态电流有利于提升轻载效率并降低待机功耗。
  • 高频工作:600kHz~1MHz 的开关频率有助于缩小滤波器体积与电感尺寸,利于空间受限的应用。
  • 大电流能力:最高 12A 输出,适合为高性能模块或多路供电前端提供动力。

四、典型应用场景

  • 单板点对点(POL)电源,如 FPGA、CPU、DSP 的核心或外设电源
  • 通信设备、路由器、基站模块的稳压电源
  • 存储及消费类电子的电源管理(SSD、电源模块)
  • 工业控制与汽车电子(在符合温度与设计规范下)

五、设计与使用要点

  • 外围器件:建议选用耐流高饱和电流、适合开关频率的电感(典型 0.6µH~1.0µH,电流额定 >12A);输入/输出侧优先使用低 ESR 陶瓷电容以抑制纹波。
  • 布局建议:大地铜箔、散热焊盘与多过孔下穿有利于热管理与高电流回路;开关节点走线尽量短,减少 EMI。
  • 热设计:高电流工作时注意器件功耗与热阻,必要时在 PCB 下方做热沉过孔或扩大散热铜箔。
  • 可靠性与测试:建议在目标负载、输入范围与环境温度下进行效率、热点与瞬态响应验证。

如需参考典型电路、布局范例或具体外设元件选型表,可提供进一步资料以便针对项目优化设计。

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