WMSIC Electronic Components

Silergy SY8286ARAC

ModelSY8286ARAC
PackageQFN-20-EP(3x3)
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
silergy SY8286ARAC
Type
SILERGY
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8286ARAC
Electronic Component
1
Package
QFN-20-EP(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.057g
Electronic Component
1
Features
Built-in LDORegulator;;; Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM69415788
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4V~23V
Switching Frequency
510kHz~690kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SY8286ARAC

一、基本信息

SY8286ARAC是一款由矽力杰(Silergy)公司推出的高效降压型DC-DC电源芯片,采用QFN-20-EP (3x3 mm)封装。作为一款内置电源管理解决方案,SY8286ARAC旨在满足广泛电子应用中对稳定电压输出的需求,特别适合用于便携式设备、消费电子、工业自动化及其他需要高效能电源转换的场合。

二、功能特点

  1. 高效能转换:SY8286ARAC具有出色的电源转换效率,有效降低功耗。它使用先进的电流模式控制技术,能够在较高负载及轻负载条件下保持高效率,最大限度地延长电池使用寿命。

  2. 宽输入电压范围:该芯片支持宽广的输入电压范围,通常为4.5V至30V,这意味着它能够满足多样化的应用需求,无论是低电压还是高电压的输入源都能适用。

  3. 输出电压可调:SY8286ARAC提供输出电压可调功能,输出电压范围可在1V至24V之间调节。这使得开发人员能够根据具体应用的需求制定合适的电源方案。

  4. 过流、过温保护:芯片内置多种保护机制,包括过流保护(OCP)、过热保护(OTP)等,确保芯片在不同工作条件下都能安全稳定工作。

  5. 小封装设计:QFN-20-EP (3x3 mm)的封装设计不仅有效节省电路板空间,同时也优化了散热性能。在现代微型化电子产品中,这一点尤为重要。

三、应用场景

SY8286ARAC广泛应用于多种电子设备,包括但不限于:

  • 便携式消费电子产品:如智能手机、平板电脑、可穿戴设备等。这些设备要求电源管理高效且可靠。
  • 工业设备:在机器人、传感器和其他自动化设备中,电源管理是确保设备稳定运行的关键。
  • LED驱动:该芯片能为LED灯具提供稳定的电压,适用于各种照明应用。
  • 通信设备:在通信基站或设备中,高效能电源转化是保证信号稳定传输的基础。

四、产品优越性

与同类产品相比,SY8286ARAC在多个方面展现出其竞争优势:

  • 效率与稳定性:拥有优于同类产品的转换效率,特别是在轻负载条件下,可以显著降低待机电流,进一步提升电池使用时间。
  • 灵活的设计性:可调输出电压和宽输入电压范围使得该产品具备极高的设计适应性,能够满足各类客户的个性化需求。
  • 优化的热管理:小型封装设计配合内置的保护功能,提升了整体热管理能力,适合高温和复杂环境下的应用。

五、总结

SY8286ARAC是矽力杰公司凭借其先进的电源管理技术推出的一款高效能降压型DC-DC电源芯片。其内置多重保护功能、宽广的输入电压范围以及可调输出电压特性,使其成为各类电子设备设计中的理想选择。无论是在消费电子、工业设备还是通信领域,SY8286ARAC都表现出出色的性能和灵活的设计,可满足不同应用需求。

通过整合高效、稳定及安全的电源解决方案,SY8286ARAC为设备开发者提供了更高效的设计路径,并在市场中树立了良好的口碑。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.