Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XUNPU SS-205-AGS7P-150
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU SS-205-AGS7P-150
- Type
- XUNPU
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- SS-205-AGS7P-150
- Electronic Component
- 1
- Package
- SMD-7P,5x1.4mm
- Electronic Component
- Switch
- Electronic Component
- 0.14g
- Electronic Component
- 1
- Electronic Component
- BM0264452862
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Switch
- 1.4mm
- Switch
- 5mm
- Switch
- Electronic Component
- Switch
- 4.25mm
- Electronic Component
- SMD
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS-205-AGS7P-150 产品概述
一 产品简介
SS-205-AGS7P-150 是讯普（XUNPU）推出的一款卧贴式单刀双掷（SPDT）滑动开关，滑钮为矩形柱状，外观为黑色，适配表面贴装工艺的小型开关方案。该型号以紧凑体积与可靠接触性能为特点，适合空间受限、需频繁开关的便携与嵌入式设备。
二 主要参数
- 电路结构：单刀双掷（SPDT）
- 尺寸（开关本体）：长 5.0 mm × 宽 1.4 mm × 高 4.25 mm
- 引脚样式：SMD 接片，封装 SMD-7P（7 引脚）
- 安装方式：卧贴（贴装于 PCB 表面）
- 滑钮形状：矩形柱状
- 额定电流：50 mA（直流）
- 额定电压：12 V（直流）
- 工作寿命：10,000 次
- 颜色：黑色
三 结构与封装特点
SS-205-AGS7P-150 采用 7 引脚 SMD 封装，主体低矮设计适合薄型机壳与紧凑 PCB 布局。滑动机构经优化以保证稳定接触与可重复性触点位置。SMD-7P 布局便于自动化贴装与回流焊接，减少手工装配成本。
四 典型应用
适用于小型遥控器、便携音频设备、手持仪器、物联网终端、消费电子产品以及需要微小电流切换或多档选择的场景。尤其适合对空间尺寸、低电流开关寿命有要求的产品设计。
五 PCB 设计与焊接建议
- 按照 SMD-7P 引脚排列设计焊盘，确保焊盘与开关底座有良好热平衡，利于回流焊接。
- 使用与元件金属化兼容的无铅或含铅焊膏，遵循常规回流曲线，避免长时间过高温度以保护塑料件。
- 在开关周围保留适当的过孔避让区和阻焊带，防止焊膏桥连或机械干扰。
- 贴装与回流后建议进行功能切换测试与外观检查，确认焊点完整与动作顺畅。
六 选型与使用注意
- 该开关额定值为 50 mA/12 V，推荐在不超过额定值的条件下长期使用；对于更高电流或更高电压场合请选用相应额定更高的型号或并联/隔离设计。
- 工作寿命为 1 万次，需考虑寿命与可靠性冗余设计（例如降低单元切换频率或采用多路冗余）以延长系统寿命。
- 对于高湿或腐蚀性环境，建议结合密封或防护罩设计，避免接点污染影响接触性能。
如需 3D 尺寸图、PCB 焊盘建议图或样品评估报告，可联系讯普（XUNPU）或其授权分销商获取更详细技术资料与支持。
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