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XUNPU WAFER-SH1.0-6PWB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU WAFER-SH1.0-6PWB
- Type
- XUNPU
- Minimum package
- 2000
Technical parameters
- Electronic Component
- XUNPU
- Electronic Component
- WAFER-SH1.0-6PWB
- Electronic Component
- 1
- Package
- SMD,P=1.0mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.27g
- Electronic Component
- 1mm
- Electronic Component
- Electronic Component
- PIN
- 6P
- Electronic Component
- 1
- Electronic Component
- SH
- Electronic Component
- BM0265062320
- Electronic Component
- LCP
- Electronic Component
- Electronic Component
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-SH1.0-6PWB线对板针座产品概述
一、产品基本信息
WAFER-SH1.0-6PWB是讯普（XUNPU）品牌SH系列下的线对板针座，核心规格为1×6P（单排6针）、间距1.0mm，采用SMD（表面贴装）卧贴安装方式。产品主要用于实现线缆与电路板之间的电信号/电力传输，是小型电子设备中常见的标准化连接解决方案，适配自动化生产与高可靠性场景需求。
二、关键技术参数
产品参数覆盖电气、机械、环境三大维度，具体如下：
- 电气性能：单PIN额定电流1A，额定电压50V（AC/DC）；触头材质为黄铜（高导电性），表面镀层为锡（优化焊接浸润性）；
- 机械尺寸：插针结构1×6P，总PIN数6；板上安装后，Z轴高度3.15mm，X轴底边长度（间距线方向）8.35mm，Y轴底边宽度4.3mm；
- 环境适应性：工作温度范围-40℃至+85℃；塑料主体材质为LCP（液晶聚合物），具备耐高温、耐化学腐蚀及尺寸稳定性。
三、结构设计与材料特性
3.1 紧凑式卧贴结构
采用1.0mm间距单排设计，在保证6针连接需求的同时，大幅缩小产品体积；卧贴安装无需电路板钻孔，可直接通过SMT自动化生产线贴装，提升生产效率，同时适配高密度PCB布局。
3.2 辅助焊脚强化设计
产品配备辅助焊脚（附加特征），焊接时可增强与PCB的机械固定力，有效降低振动环境下的虚焊、脱焊风险，尤其适用于车载、工业控制等对可靠性要求较高的场景。
3.3 材料性能优化
- 触头：黄铜基底+锡镀层，既保证导电效率，又具备良好的焊接兼容性（适配常见焊料），降低焊接不良率；
- 塑料主体：LCP材质，可承受短期高温回流焊（约260℃），长期使用下尺寸稳定，不易因温度变化变形，提升连接可靠性。
四、典型应用场景
WAFER-SH1.0-6PWB因体积小、可靠性高，广泛应用于以下领域：
- 小型消费电子：蓝牙耳机、智能手环、便携式音箱等可穿戴/手持设备的内部模块连接；
- 工业控制模块：传感器接口、小型PLC、电机驱动板的线缆与板端连接；
- 汽车电子配件：车载显示屏、倒车雷达控制器、胎压监测传感器的线板连接（适配车载宽温环境）；
- 通信设备：小型基站配件、路由器/交换机的内部模块间连接。
五、产品优势亮点
- 小型化适配：1.0mm间距+卧贴封装，体积紧凑，满足当前电子设备“轻、薄、小”的设计趋势；
- 焊接可靠性：辅助焊脚+锡镀层设计，有效提升焊接牢固度，降低售后返修率；
- 宽温适应性：-40℃至+85℃的工作范围，可在极端环境下稳定工作；
- 自动化兼容：SMD封装适合SMT自动化生产，无需额外手工操作，提升产能；
- 成本可控：黄铜+锡镀层的触头设计，兼顾性能与成本，适合批量应用场景。
该产品通过标准化规格与可靠设计，成为小型电子设备线对板连接的高性价比选择，可满足多数中端及以下设备的连接需求。
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