WMSIC Electronic Components

XUNPU WAFER-GH1.25-6PLB

ModelWAFER-GH1.25-6PLB
PackageSMD,P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

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Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-GH1.25-6PLB
Type
XUNPU
Minimum package
1000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-GH1.25-6PLB
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.56g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
6P
Electronic Component
1
Electronic Component
GH
Electronic Component
BM0265062303
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-GH1.25-6PLB 线对板针座产品概述

一、产品定位与基础规格

WAFER-GH1.25-6PLB是讯普(XUNPU)推出的GH系列线对板立贴针座,专为小型化电子设备的信号传输与低功耗电源连接设计。该产品采用1排6PIN(1×6P)插针结构,针距1.25mm,符合SMD表面贴装工艺要求,安装方式为立贴(垂直于PCB板),可与GH系列配套端子线无缝配合,是紧凑空间内实现线板连接的高性价比选择。

基础规格明确:总PIN数6、单排布局、每排6PIN,封装参数为SMD/P=1.25mm,整体结构紧凑,适配高密度PCB布局需求,避免占用过多板上空间。

二、关键性能与电气参数

该针座的电气性能稳定可靠,核心参数覆盖常见应用场景的需求:

  1. 电气指标:额定电流1A(AC/DC)、额定电压125V(AC/DC),可满足小功率电源传输(如5V/1A以内)及数字信号(I2C、SPI等)的稳定传输;
  2. 温度适应性:工作温度范围为-25℃至+85℃,覆盖工业、消费电子等领域的常见环境温度区间,即使在高温(如车载环境)或低温(如户外传感器)下仍能稳定工作;
  3. 材质特性:触头采用黄铜材质,导电性能优异,表面镀锡处理,焊接性好且抗氧化能力强;塑料外壳采用LCP(液晶聚合物)材质,耐温性、耐化学性突出,长期使用不易变形老化。

三、结构设计与工艺特点

WAFER-GH1.25-6PLB在结构上兼顾紧凑性与可靠性,细节设计适配实际装配需求:

  1. 尺寸参数:板上Z轴(垂直方向)高度4.2mm,X轴(沿间距线)底边长度10.75mm,Y轴(水平宽度)4.95mm,整体体积小巧,适配PCB板上的窄空间布局;
  2. 辅助焊脚设计:额外增加辅助焊脚结构,与触头焊盘共同形成焊接点,显著提升产品的抗振动、抗冲击能力,降低振动环境下(如汽车行驶、工业设备运行)的脱焊风险;
  3. 外观与配合:塑料外壳为米色,便于生产过程中的识别与装配;插针结构精准,与配套端子线的插拔配合顺畅,接触力适中,避免过松导致接触不良或过紧损坏插针。

四、应用场景适配

由于其紧凑尺寸、稳定性能及立贴安装方式,该针座广泛适配以下场景:

  1. 消费电子:智能家居设备(如传感器节点、智能开关)、智能穿戴产品(如手环电池连接)、小型家电控制模块;
  2. 工业控制:小型PLC的I/O接口、传感器模块(如温度、湿度传感器)、微型执行器控制单元;
  3. 汽车电子:低功率控制模块(如仪表盘指示灯、车门传感器)、车载小型辅助设备;
  4. 通讯设备:小型路由器、交换机的内部信号连接。

五、品牌与可靠性保障

讯普(XUNPU)作为专业电子连接器制造商,WAFER-GH1.25-6PLB遵循严格的生产工艺与质量管控:

  1. 材质管控:触头黄铜纯度符合行业标准,锡镀层厚度均匀(确保焊接可靠性);LCP塑料经高温老化测试,性能稳定;
  2. 工艺验证:产品经过插拔寿命测试(常规可达50次以上插拔无故障)、振动测试(符合汽车级振动标准)、温度循环测试等,满足不同场景的可靠性要求;
  3. 适配性:与GH系列配套端子线的兼容性经过验证,插拔力适中,接触电阻稳定(≤20mΩ),减少系统故障风险。

该产品以高性价比、稳定性能及紧凑设计,成为小型电子设备线板连接的优选方案。

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