WMSIC Electronic Components

XUNPU SMN-305-ARP7

ModelSMN-305-ARP7
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU SMN-305-ARP7
Type
XUNPU
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
SMN-305-ARP7
Electronic Component
1
Package
SMD
Electronic Component
SIM Connector
Electronic Component
0.689g
Type
Nano SIM
Electronic Component
1
Electronic Component
BM0265062285
Operating Temperature
25℃~+85℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMN-305-ARP7 翻盖式NanoSIM卡连接器产品概述

一、产品定位与核心价值

SMN-305-ARP7是讯普(XUNPU)针对轻薄化设备推出的翻盖式NanoSIM卡连接器,核心解决消费电子、物联网终端中SIM卡的稳定连接、便捷插拔与小体积集成需求。其价值聚焦于:

  • 1.4mm超薄本体适配当前设备“轻薄化”趋势(如智能手表、超薄平板);
  • 翻盖式设计无需工具即可快速插拔,提升生产与售后维护效率;
  • 内置插卡检测功能,支持设备实时识别SIM卡状态,避免误判;
  • SMD表面贴装封装兼容自动化贴装线,降低批量生产升本。

二、关键技术参数

项目 规格参数 说明 卡连接方式 翻盖式 卡扣锁定,开合顺畅 适配卡类型 NanoSIM卡 符合国际标准尺寸,兼容主流运营商SIM卡 连接器类型 卡座 固定于PCB板,提供物理+信号连接 插卡检测 有(机械触发) 插卡到位后输出“卡在位”信号 本体最大高度 1.4mm 超薄设计,适配1.6mm及以下PCB板 工作温度范围 -25℃ ~ +85℃ 覆盖常规消费电子与部分工业环境 封装形式 SMD(表面贴装) 无引脚设计,适合回流焊工艺 品牌 XUNPU(讯普) 国内专业连接器制造商,通过RoHS认证

三、结构设计亮点

  1. 翻盖式开合机构
    采用卡扣式锁定设计,单次开合角度≤120°,插拔时间≤2秒;锁定后可承受10G振动(符合IEC 60068标准),避免设备移动中松脱。

  2. 超薄本体适配
    1.4mm的最大高度远低于行业平均2.0mm水平,有效节省设备内部空间,适配智能手表、超薄笔记本等对厚度敏感的产品。

  3. 触点可靠性设计
    触点采用镀金工艺(厚度≥0.3μm),耐腐蚀、抗氧化,支持≥5000次插拔(满足设备3-5年生命周期需求)。

  4. 集成插卡检测
    内置微动触发开关,插卡到位后立即输出低电平信号(可直接连接MCU IO口),避免“假插卡”导致的联网失败。

  5. 耐高温材质
    本体采用LCP(液晶聚合物)工程塑料,可承受回流焊峰值温度245℃±5℃,适配自动化生产流程。

四、典型应用场景

  1. 消费电子终端:智能手机、平板电脑、智能手表、电子书阅读器(轻薄化需求);
  2. 物联网终端:智能门锁、POS收款机、快递柜控制模块、环境监测传感器(联网稳定需求);
  3. 车载电子:车载导航、车机系统、行车记录仪(宽温适应车内温差);
  4. 工业手持设备:数据采集器(PDA)、工业巡检仪(抗振动需求)。

五、可靠性与环境适应性

  • 插拔寿命:≥5000次正常插拔(符合行业标准);
  • 抗振动冲击:通过10-2000Hz振动测试、15G冲击测试,无接触不良;
  • 温湿度适应:存储温度-40℃~+85℃,湿度95%以下,适应全球仓储运输;
  • 环保认证:符合RoHS 2.0标准,无铅、无镉、无汞,满足国际市场准入。

六、安装与使用注意事项

  1. 贴装工艺:采用回流焊,需控制温度曲线(峰值245℃±5℃,时间≤30秒),避免本体变形;
  2. 插拔操作:翻盖开合避免过度用力,插卡时对准缺口与定位槽,禁止反向插入;
  3. 维护建议:长期使用后用压缩空气清理卡座灰尘,避免触点氧化;
  4. 信号匹配:插卡检测信号为低电平触发,需确认设备MCU电平兼容(3.3V/5V通用)。

SMN-305-ARP7凭借“超薄、便捷、可靠”的核心特性,成为轻薄化设备SIM卡连接的优选方案,广泛适配消费电子与物联网领域的量产需求。

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