WMSIC Electronic Components

XUNPU FPC-05FB-50PH20

ModelFPC-05FB-50PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05FB-50PH20
Type
XUNPU
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05FB-50PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.893g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265062283
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
50P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05FB-50PH20 翻盖式FFC/FPC连接器产品概述

一、产品定位与核心应用场景

FPC-05FB-50PH20是讯普(XUNPU)针对小间距高密度排线连接需求推出的FFC/FPC连接器,核心定位为空间紧凑、需稳定传输多信号/低功率电源的电子设备。典型应用覆盖:

  • 便携式消费电子:智能手机、平板的FPC与主板连接;
  • 智能穿戴:智能手表、手环的排线接口;
  • 小型医疗仪器:便携式血糖仪、血压计的传感器连接;
  • 智能家居:智能门锁、音箱的内部排线;
  • 轻载工业控制:小型PLC、传感器模块的信号传输。

二、核心结构特性

1. 翻盖式锁定设计

采用手动翻盖开合结构,无需额外工具即可快速完成FFC/FPC电缆的接入/断开:翻盖抬起时放入电缆,下压锁定后实现紧密连接,装配效率高,适合批量自动化生产。

2. 双侧触点/上下接

触点采用双侧接触方式,与FPC电缆上下双面接触,接触面积比单侧触点提升30%以上,大幅降低虚接风险,即使在振动环境下也能保持稳定连接。

3. 小间距高密度

间距仅0.5mm,集成50Pin触点,在10mm左右宽度内实现多通道信号/电源同步传输,满足设备小型化设计需求。

4. 低profile卧贴封装

板上高度仅2mm,采用表面贴装(SMD)卧贴方式,焊接后与PCB贴合紧密,不占用额外垂直空间,适配超薄设备内部布局。

5. 柔性电缆适配

支持0.3mm厚度的FFC/FPC柔性电缆,覆盖主流柔性排线规格,无需额外定制电缆即可直接使用。

三、电气性能参数

该产品电气性能满足多数中低压场景需求:

  • 额定电压:50V AC/DC,可覆盖信号传输与低功率电源(如5V/12V);
  • 额定电流:单触点500mA,50Pin可同时传输多通道小功率电流(总电流需符合降额设计);
  • 触头材质与镀层:触头采用磷青铜(导电率高、弹性稳定),表面镀锡处理——抗氧化能力强,接触电阻典型值<20mΩ,焊接性良好(适配无铅焊接);
  • 绝缘电阻:25℃、500V DC下>100MΩ,避免信号串扰。

四、机械性能与可靠性

  1. 插拔寿命:翻盖结构设计合理,插拔次数可达50次以上,满足设备生命周期内的维护需求;
  2. 接触力均匀:双侧触点单触点接触力约0.15N,受力均衡,不易因振动导致松脱;
  3. 安装稳定性:卧贴SMD封装焊接后,与PCB贴合度高,抗振动(10~2000Hz,1g加速度)性能良好。

五、环境适应性

  • 工作温度:-25℃~+85℃,覆盖多数室内外消费电子、工业轻载场景(如车内常温区域);
  • 存储温度:-40℃~+85℃,满足长期仓储需求;
  • 湿热环境:相对湿度95%以下可稳定工作,镀锡触头有效抑制氧化。

六、品牌与成本优势

讯普(XUNPU)作为国内连接器专业厂商,该产品具备:

  • 一致性好:标准化生产工艺,批量产品参数偏差<5%;
  • 环保合规:符合RoHS、REACH指令,无铅无有害物质;
  • 性价比高:成本低于进口同类产品,适合中低端到中端设备批量应用。

综上,FPC-05FB-50PH20凭借“小间距高密度、翻盖式便捷装配、双侧触点可靠连接”等特性,成为小型电子设备排线连接的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.