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XUNPU TF-123-ARP9H17
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU TF-123-ARP9H17
- Type
- XUNPU
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- TF-123-ARP9H17
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SD / Connector
- Electronic Component
- 0.36g
- Type
- Micro SD
- Electronic Component
- 1
- Electronic Component
- BM0264592167
- Operating Temperature
- 25℃~+85℃
- Electronic Component
- Electronic Component
- Connector Type
- Card Socket
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Electronic Component
- 1.7mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TF-123-ARP9H17 MicroSD卡连接器产品概述
一、产品核心定位与应用场景
TF-123-ARP9H17是讯普（XUNPU）针对小型化电子设备推出的拔插式MicroSD（TF）卡专用卡座，采用SMD表面贴装封装，核心聚焦“轻薄适配+宽温可靠”两大特性，精准匹配对空间紧凑性、环境适应性要求较高的应用场景：
- 便携智能设备：智能手表、蓝牙耳机盒、运动相机等穿戴/手持设备，需低高度卡座适配机身轻薄化设计；
- 车载电子系统：车载导航、行车记录仪、车载音响的存储扩展，宽温范围（-25℃~+85℃）满足车内高低温环境；
- 工业控制终端：小型数据采集器、物联网网关的本地存储扩展，拔插式设计便于现场数据读取/更新。
二、关键技术参数详解
该产品参数围绕“小型化+可靠性”优化，核心指标如下：
类别 具体参数 卡连接方式 拔插式（无自锁弹出结构，操作便捷） 兼容卡类型 标准MicroSD（TF）卡（含SDHC/SDXC） 封装形式 SMD表面贴装（引脚间距符合行业标准） 本体最大高度 1.7mm（低profile，适配超薄设备） 工作温度范围 -25℃~+85℃（工业级宽温） 拔插寿命 ≥5000次（触点耐磨性能优异） 触点接触电阻 ≤30mΩ（初始值，高低温循环后≤50mΩ）三、结构设计与工艺特点
- 低高度优化：通过内部触点布局压缩与外壳折弯工艺升级，本体高度仅1.7mm（比常规卡座降低约30%），可适配0.8mm~1.2mm厚度的设备壳体；
- SMD封装优势：引脚采用镀锡工艺，回流焊兼容性好，贴装精度±0.1mm，适合大规模自动化生产；
- 触点防护：触点表面镀金厚度≥0.3μm，防止氧化，确保长期信号传输稳定；外壳采用ABS+PC耐高温材料，耐冲击、抗老化；
- 卡定位结构：内部设置精准卡舌与限位槽，MicroSD卡插入后自动对位，避免偏斜导致的触点磨损，提升拔插体验。
四、性能优势与可靠性验证
- 信号传输稳定：经高低温循环测试（-25℃~+85℃，1000次循环）后，接触电阻仍≤50mΩ，满足Class10高速卡的数据传输要求；
- 环境适应性强：通过湿热测试（40℃/95%RH，96小时）、盐雾测试（5%NaCl，48小时），适合潮湿、沿海等复杂环境；
- 抗振动冲击：符合GB/T 2423.10振动标准（10~2000Hz，加速度2g），车载场景下无触点松动或卡脱落问题。
五、安装与使用注意事项
- 贴装要求：回流焊温度曲线需符合IPC/JEDEC J-STD-020标准，峰值温度≤260℃，避免高温导致外壳变形；
- 拔插操作：插入时确认卡方向（触点面朝上），轻推至“咔嗒”声；拔出时用指甲轻推卡尾部，勿用工具撬动；
- 维护建议：定期用干燥软布擦拭卡座灰尘，避免液体/金属碎屑进入；若卡无法拔插，勿强行操作，检查方向或清理异物。
总结
TF-123-ARP9H17作为讯普针对小型化设备的主力MicroSD卡座，凭借低高度、宽温可靠、拔插便捷等特点，已成为智能穿戴、车载电子、工业终端等领域的优选存储连接方案，其高性价比与稳定性能满足不同场景的实际需求。
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