WMSIC Electronic Components

XUNPU WAFER-GH1.25-8PWB

ModelWAFER-GH1.25-8PWB
PackageSMD,P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-GH1.25-8PWB
Type
XUNPU
Minimum package
1000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-GH1.25-8PWB
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.57g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
8P
Electronic Component
1
Electronic Component
GH
Electronic Component
BM0265062322
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-GH1.25-8PWB 线对板针座产品概述

WAFER-GH1.25-8PWB是讯普(XUNPU)推出的GH系列线对板卧贴针座,专为紧凑空间内的电气连接设计,具备小间距、高可靠性、易自动化生产等核心特点,广泛适配消费电子、智能家居、小型工业设备等场景的信号/电源传输需求。

一、产品核心定位与关键特征

该产品属于单排8Pin线对板针座,采用1.25mm间距卧贴SMD封装,核心优势集中在空间利用率与连接可靠性:

  • 小间距设计(1.25mm):有效压缩PCB布局空间,适配薄型、微型设备;
  • 卧贴安装:无需插件工序,兼容自动化贴片生产,提升生产效率;
  • 辅助焊脚结构:增强焊接强度,降低振动、冲击导致的脱落风险;
  • 宽温材料适配:LCP塑料与锡镀层触头,满足-25℃~+85℃环境下的稳定工作。

二、基础规格参数

项目 参数说明 插针结构 1排×8Pin(1x8P) 引脚间距 1.25mm 安装方式 卧贴(SMD) 参考系列 GH系列 总Pin数 8P 板上尺寸参数 Z轴高度4.35mm;X轴底边长度13.25mm;Y轴宽度5mm 颜色 米色 附加特征 带辅助焊脚

(注:参数符合讯普GH系列标准,适配对应线端连接器使用)

三、电气性能与触头设计

1. 电气参数

  • 额定电流:1A(单Pin持续电流,满足小功率信号/电源传输);
  • 额定电压:125V(AC/DC通用,适配低压设备需求);
  • 接触电阻:≤20mΩ(黄铜锡镀层触头,保障信号完整性)。

2. 触头结构

采用黄铜基材+锡镀层:

  • 黄铜:导电性能优异,机械强度高,抗磨损;
  • 锡镀层:抗氧化、耐腐蚀,降低接触电阻,延长使用寿命。

四、结构与材料特性

1. 塑料主体(LCP材质)

塑料部分选用液晶聚合物(LCP),具备以下优势:

  • 耐高温:长期工作温度-25℃~+85℃,短期可承受更高温度;
  • 尺寸稳定:成型精度高,减少温湿度变化导致的变形;
  • 耐化学性:抗溶剂、油脂腐蚀,适配复杂环境。

2. 辅助焊脚作用

产品自带2个辅助焊脚(位于针座两端):

  • 增加焊接面积,提高焊接强度;
  • 分散应力,降低振动、插拔过程中Pin脚脱落风险;
  • 辅助定位,提升贴片精度。

五、安装与应用场景

1. 安装方式

  • 卧贴SMD封装:直接通过贴片工艺焊接于PCB表面,无需插件、手工焊接,适配自动化生产线;
  • 安装注意事项:需确保PCB焊盘尺寸与针座引脚匹配,焊接温度符合SMD标准(建议240℃~260℃,峰值不超过265℃)。

2. 典型应用场景

  • 消费电子:智能手环、蓝牙耳机、微型投影仪的内部连接;
  • 智能家居:智能开关、传感器节点、小型控制器的线板连接;
  • 小型工业设备:微型PLC、传感器模块、工业摄像头的信号传输;
  • 可穿戴设备:智能手表、健康监测设备的电池与主板连接。

六、产品优势总结

  1. 空间高效:1.25mm小间距+卧贴设计,比传统插件针座节省30%以上PCB空间;
  2. 可靠性强:辅助焊脚+LCP材料,抗振动、耐高温,适配恶劣环境;
  3. 生产适配:SMD封装兼容自动化贴片,降低人工成本与焊接不良率;
  4. 性能稳定:黄铜锡镀层触头,低接触电阻保障信号/电源传输质量;
  5. 品牌保障:讯普(XUNPU)GH系列成熟产品,经过多轮可靠性测试(插拔寿命≥500次)。

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